Senior OSAT Engineer

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Intel Corporation

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Hardware • Artificial Intelligence • Telecommunications

Intel Corporation is a leading technology company that specializes in manufacturing and selling a variety of hardware and software products. Its offerings include processors such as Intel Core, Intel Xeon, and Intel Atom, as well as discrete graphics, AI accelerators, silicon photonics, and embedded solutions. Intel serves various industries with its networking, storage solutions, and developer resources, focusing heavily on AI and performance-driven technologies. The company plays a significant role in advancing computing experiences across PCs, data centers, cloud, edge, and 5G networks. Intel is committed to delivering high performance and secure technologies while fostering innovation through its expansive partner ecosystem and development tools.

10,000+ employees

Founded 1968

🔧 Hardware

🤖 Artificial Intelligence

📡 Telecommunications

📋 Description

• Lead technical engagement with OSAT suppliers on assembly and test process development, yield ramp, quality improvement, and volume manufacturing readiness. • Drive new product introduction (NPI) from engineering builds through production release, ensuring OSAT capability meets electrical/thermal/mechanical requirements for FPGA and SoC products. • Optimize packaging and test architectures for performance, cost, and reliability: flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, burn-in/FT coverage. • Monitor and improve backend yield performance using data-driven analysis; identify systemic issues and lead root cause / corrective actions. • Partner with Test Engineering, Packaging, Product Engineering, DFM, and Quality teams on process optimization, failure analysis, and manufacturability improvements. • Implement and maintain process control systems, SPC methodologies, automation improvements, and lean manufacturing principles at OSAT. • Support cost reduction initiatives including BOM optimization, process simplification, and cycle time improvements. • Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans. • Lead or support reliability testing and package qualification activities aligned to industry standards (JEDEC, IPC, AEC-Q). • Maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency, collaboration, and escalation management.

🎯 Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field. • 10+ years of semiconductor assembly, packaging, or test engineering experience. • Hands-on experience with OSAT manufacturing environments, including wafer finishing, substrate attach, interconnect packaging, test, and burn-in. • Strong technical understanding of backend manufacturing flows: flip-chip, wire bond, underfill, molding, final test, reliability stress and analysis. • Proven ability to analyze yield, reliability, and cost data to drive engineering decisions and improvements. • Demonstrated success working with international suppliers and cross-functional teams. • Strong written and verbal communication skills, including technical reporting and supplier engagement.

🏖️ Benefits

• Professional development opportunities