
51 - 200 employees
Founded 2011
🔧 Hardware
📡 Telecommunications
🔬 Science
Hardware • Telecommunications • Science
Kandou is a specialist in high-speed, high-quality signal conditioning, focused on enhancing wired connections through advanced technology. Their product portfolio includes industry-leading PCIe Retimers, USB4 Retimers, and state-of-the-art PCIe switches that offer superior performance and reliability for various applications. With a commitment to connectivity perfection, Kandou utilizes its world-class chips and a Tier 1 supply chain to ensure that their solutions are fast, clear, and impactful.
🕒 March 24
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51 - 200 employees
Founded 2011
🔧 Hardware
📡 Telecommunications
🔬 Science
Hardware • Telecommunications • Science
Kandou is a specialist in high-speed, high-quality signal conditioning, focused on enhancing wired connections through advanced technology. Their product portfolio includes industry-leading PCIe Retimers, USB4 Retimers, and state-of-the-art PCIe switches that offer superior performance and reliability for various applications. With a commitment to connectivity perfection, Kandou utilizes its world-class chips and a Tier 1 supply chain to ensure that their solutions are fast, clear, and impactful.
• Lead the SI/PI function at Kandou AI, defining methodologies, best practices, and technical direction • Partner with technology and product teams to guide SI/PI architecture and resolve system-level challenges • Work closely with circuit designers to ensure robust SI/PI implementation in silicon • Engage with customers and suppliers to define and validate hardware solutions (packages, PCB/backplane layouts, materials, interposers, connectors) for Kandou products • Perform and lead theoretical and simulation-based SI analysis of products, channels, test structures, and system implementations • Prepare and communicate technical analyses and recommendations to internal teams and external stakeholders • Evaluate and benchmark signaling schemes (e.g., Chord signaling, PAM) in terms of SI/PI performance, power, and implementation trade-offs • Drive SI/PI and power delivery solutions for packages and evaluation platforms in collaboration with design teams • Collaborate with system architects to define and extract channel specifications and requirements
• 15+ years of experience in the semiconductor industry, with a focus on topics related to signal and power integrity • Strong foundation in electromagnetics and system-level design, including material (package, PCB, board, connector, cable), as well as analog, power, and digital electronics • Proven leadership of SI/PI, package, and PCB teams delivering multi-Gbps link solutions • Must be able to articulate one or more significant SI problems that were solved with innovative design of connector, package or cable • Hands-on problem solver with the ability to quickly grasp new concepts and translate them into practical solution • Curious, fast learner who thrives in tackling unfamiliar challenges and driving them to completion in real-world systems • Collaborative team player with strong cross-functional communication skills • Required: Masters of Engineering in Physics Electronics or Electrical Engineering (equivalent or higher) • Desired: PhD in electromagnetics related areas such as physics or Electrical or Electronics engineering
• No specific benefits mentioned
Apply Now🕒 March 24
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