Design Release Engineer – Semiconductor

🕒 il y a 22 jours

🚗 Michigan – Distant

🚗 Michigan – Remote

💵 $124 702 - $161 100 / an

⏰ Temps Plein

🟡 Intermédiaire

🟠 Senior

⛑ Ingénieur DevOps & SRE

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General Motors

Site WebLinkedInTous les Emplois

10 000+ employés

Fondée en 1908

🚗 Transport

⚡ Énergie

🏢 Entreprise

💰 €500 000 000 Grant en 2024-07

Transport • Energy • Enterprise

General Motors est une multinationale de premier plan dans l'industrie automobile, engagée dans la création d'un avenir sans accidents, sans émissions et sans congestion. Avec des opérations et des installations dans le monde entier, GM se concentre sur l'innovation dans divers domaines, notamment l'ingénierie, la fabrication et les technologies de l'information. L'entreprise met l'accent sur la diversité, l'inclusion et le développement de technologies durables pour façonner l'avenir de la mobilité.

Description

• Create and maintain deliverables and processes according to the key area assignment of the Compute and Connectivity Design Support Team. • Create and manage Engineering Change Requests for GM semiconductor part numbers. • Analyze and approve supplier semiconductor resiliency plan submissions. • Create and maintain GM semiconductor catalog items as assigned. • Create electronic circuit schematics as assigned. • Support GM IT and Purchasing semiconductor initiatives. • Develop and maintain templates and tools, Support or define enterprise sourcing strategies & business models based on key area of assignment. • Work with execution teams to ensure that the GM strategic vision is implemented by design teams in ECU semiconductor component selection. • Model and develop GM's Core Values and Winning Behaviors.

🎯 Exigences

• Bachelor's degree in Electrical Engineering, Electronic Engineering, or related field of study • Three (3) years of experience as a Design Release Engineer – Security Gateway, Product Design Engineer, Hardware Test Engineer, Hardware Engineer, or related occupation • Three (3) years of experience with: Automotive Component Release process; Automotive Change management process; Product Development engineering; Product design and development cycles; ECU schematic creation; Hardware validation of ASICs; Printed Circuit Board Debugging; PCB Thermal Validation; Creating Semiconductor Design Reference Manuals; and Creating ECU Component Technical Specifications.

🏖️ Avantages

• Bonus Potential: An incentive pay program offers payouts based on company performance, job level, and individual performance.