Package Design Engineer

🕒 2 days ago

🌐 Mexico, Netherlands, +4 more countries – Remote

🇲🇽 Mexico – Remote 🇳🇱 Netherlands – Remote 🇩🇪 Germany – Remote 🇫🇷 France – Remote 🇬🇧 United Kingdom – Remote 🇮🇱 Israel – Remote

⏰ Full Time

🟠 Senior

🔴 Lead

🧑‍🔧 Mechanical Engineer

👻 Ghost score 10%

What it means: how likely this posting is sitting open without active hiring.How to read it: 60% or higher means we think this is a ghost. Lower scores are less of a worry.How we score it: age, reposts, open roles vs team size, how fast jobs close, and whether pay is listed.Fine print: an estimate from public data, not a judgment of the company. Real jobs can score high, so treat it as a hint, not a fact.

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SPD Technology

WebsiteLinkedInAll Job Openings

501 - 1000 employees

Founded 2006

💳 Fintech

🤖 Artificial Intelligence

🤝 B2B

Fintech • Artificial Intelligence • B2B

SPD Technology is a global software product development company that delivers custom digital platforms, cloud and DevOps, AI/ML, and fintech/payment solutions. They specialize in application modernization, data analytics and engineering, system integration and APIs, security and quality engineering, and mobile/web UX/UI development. SPD works as a B2B partner for enterprise and growth-stage clients (notable customers cited include PitchBook and Poynt), focusing on building payment systems, billing and fraud-detection software, data platforms, and AI-enabled products for industries such as fintech, insurance, healthcare, and e-commerce.

📋 Description

• Develop physical package substrate designs for large form-factor packages for ML high-performance computers (HPCs) • Develop and implement methodology and CAD flow for efficient substrate design and enhanced productivity • Manage and drive co-design initiatives across chip, package, and system levels • Secure production sign-off for package designs • Collaborate with SI/PI, thermal, mechanical, assembly, and PCB engineering teams • Refine and optimize product package designs, test vehicles, and mock-up designs for product feasibility • Manage routing feasibility studies, test vehicle development, product-level designs, design reviews, artwork export, DFM activities, and final manufacturing documentation • Define and document package substrate design requirements and bill of materials (BOM) • Contribute to evaluation and adoption of advanced chip packaging technologies • Support deployment of advanced computing systems in large-scale data center environments and optimize PPA and TCO

🎯 Requirements

• Bachelor's degree in Mechanical Engineering, Material Engineering, Electrical Engineering, Technology, Science, a related field, or equivalent practical experience • 8 years of experience in chip package substrate design using Cadence APD or Mentor Expedition • Experience in chip package substrate layout, design verification, DFM, and taping out for production • Experience in design automation and scripting • English — Upper Intermediate or higher • Experience working with cross-functional teams including chip design, SI/PI, and PCB design teams • Experience in 2.5D/3.5D advanced package design • Experience in physical verification flow (LVS, DRC, connectivity) • Experience with CAD for creating simple mechanical drawings, such as package outline drawings (POD) • Ability to write scripts to customize elements of the Cadence or Mentor workflow

🏖️ Benefits

• Fully remote work around the globe • Hybrid work model available from office hubs • Flexible working schedule • Stable workload and stable income • Performance review and career path • Mentorship program • Personal development plan • Individual learnings through the corporate library • Public speaking support • Company-wide tech and cultural events • Meaningful CSR initiatives • Supportive work environment with collaboration, open communication, and mutual respect