PCB Layout Engineering Lead

🕒 5 dias atrás

🇺🇸 Estados Unidos – Remoto (EUA)

💵 $210.000 - $230.000 / ano

⏰ Tempo Integral

🟠 Sênior

🧑‍💻 Engenheiro Full-stack

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Cerebras

SiteLinkedInTodas as Vagas

501 - 1000 funcionários

🔧 Hardware

🤖 Inteligência Artificial

☁️ SaaS

Hardware • Artificial Intelligence • SaaS

A Cerebras é uma empresa que fabrica chips de IA em escala de wafer (o Wafer-Scale Engine) e sistemas projetados para inferência e treinamento de IA ultra-rápidos. Eles oferecem o sistema CS-3 e a Cerebras Inference Cloud com compatibilidade direta com a API OpenAI, permitindo implantação local, em nuvem e na borda, e fazem parcerias com empresas como AMD, CrowdStrike, Flex e grandes corporações. Sua mensagem de produto destaca chips extremamente grandes (58x maiores que GPUs), velocidade e throughput massivos (até 15x inferência mais rápida, milhares de tokens por segundo) e casos de uso em serviços de modelos, ajuste fino e pré-treinamento. Os clientes incluem OpenAI, Meta, GSK, Mayo Clinic, AWS e outros; as aplicações abrangem infraestrutura de IA, agentes em tempo real, genômica, descoberta de medicamentos, cibersegurança e busca empresarial. A Cerebras foca em hardware de IA de alto desempenho e ofertas de software/plataforma integradas para treinamento e inferência.

Descrição

• Own multilayer PCB layout from initial component placement through fabrication and assembly release • Translate schematics, mechanical constraints, and electrical requirements into constraint-driven board designs • Define and implement board stackups, controlled-impedance structures, routing rules, reference planes, return paths, and length- and phase-matching constraints • Place and route high-speed digital, high-current power, and sensitive analog circuits, including dense BGA fanout and differential interfaces • Apply signal-integrity and power-integrity best practices to minimize crosstalk, discontinuities, noise, voltage drop, and electromagnetic interference • Collaborate with electrical, SI/PI, mechanical, thermal, compliance, manufacturing, and test engineers • Work with fabrication and assembly partners to select materials, validate stackups and via structures, and improve yield, cost, and schedule • Perform design reviews and DFM, DFA, and DFT checks • Generate and verify fabrication drawings, assembly drawings, drill data, Gerbers, ODB++, IPC-2581, and related release packages • Maintain component footprints, padstacks, design libraries, layout standards, and release documentation • Support prototype builds, board bring-up, failure analysis, and layout revisions through production

🎯 Requisitos

• Bachelor’s degree in electrical engineering, electronics engineering, or a related field, or equivalent practical experience • 10+ years of hands-on experience laying out complex, high-speed, multilayer printed circuit boards • Expertise with Cadence Allegro PCB Designer and Constraint Manager • Experience with Altium Designer or equivalent tools • Strong knowledge of component placement, controlled-impedance routing, differential pairs, length matching, return-path continuity, and power distribution • Experience with dense BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, and backdrilling • Working knowledge of signal integrity, power integrity, EMI/EMC, thermal design, creepage and clearance, and high-current routing • Experience applying IPC standards and fabrication, assembly, test, and manufacturability requirements • Ability to create and review complete PCB fabrication and assembly release packages • Ability to thrive in a fast-paced, dynamic environment and adapt to changing priorities • Excellent collaborative and interpersonal skills with multi-disciplined teams • Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, or enterprise products • Preferred: experience designing large, high-layer-count boards for compute, networking, server, or AI accelerator systems • Preferred: experience routing DDR4/DDR5, PCIe Gen4/Gen5 or later, Ethernet, USB, and multi-gigabit SerDes • Preferred: experience with high-current, low-voltage power delivery, VRM placement, decoupling strategy, copper balancing, and thermal optimization • Preferred: experience developing Allegro SKILL, scripts, or automation • Preferred: success delivering first-pass functional boards and supporting products from prototype through volume production

🏖️ Benefícios

• Bonus and equity may be included in actual compensation • Job stability with startup vitality • Simple, non-corporate work culture that respects individual beliefs • Opportunities to publish and open source cutting-edge AI research • Work on one of the fastest AI supercomputers in the world • Continuous learning, growth and support • Equal and diverse work environment