Packaging Engineer – Materials

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🏄 California, Massachusetts, +1 estados a mais – Remoto

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Volantis Semiconductor

SiteLinkedInTodas as Vagas

2 - 10 funcionários

Fundada em 2022

🔧 Hardware

🤖 Inteligência Artificial

🤝 B2B

🔥 Investimento no último ano

💰 $88.000.000 Series A em 2026-09

Hardware • Artificial Intelligence • B2B

A Volantis Semiconductor é uma empresa de hardware que desenvolve interconexões fotônicas (minúsculas guias de onda ópticas em grandes substratos) para aceleradores de IA e o pooling de memória em datacenters. Sua tecnologia amplia o alcance óptico em aproximadamente 100 vezes em comparação com interconexões elétricas, viabilizando pools de memória rápida no nível do rack, com largura de banda muito maior e capacidade significativamente superior. Assim, a inferência de modelos com mais de 10 trilhões de parâmetros pode ser executada com baixa latência, semelhante à de SRAM. A empresa captou US$ 88 milhões em uma rodada Series A e conta com investidores como Sam Altman e Jeff Dean. Sua equipe reúne profissionais com experiência em co-packaged optics, HBM e CoWoS. A Volantis fornece componentes de infraestrutura fotônica de IA para outras empresas de hardware e infraestrutura, reduzindo o custo por token e superando o memory wall na inferência de modelos de grande porte.

Descrição

• Own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing • Lead wafer level mold and underfill process development for advanced semiconductor packages, including fan-out wafer level packaging, 2.5D/3D, and chiplet architectures • Develop and optimize compression molding, transfer molding, and mold underfill (MUF) processes • Select and qualify mold compounds and underfill materials based on filler content, CTE, modulus, Tg, viscosity, and moisture uptake • Develop capillary underfill dispense strategies, optimize flow and voids, and develop cure profiles for flip chip and chiplet assemblies • Evaluate and mitigate warpage, delamination, void formation, bleed-out, mold flash, and filler settling; define process windows and controls • Collaborate with OSATs and material suppliers to qualify materials, define dispense and cure equipment requirements, and transfer processes into production • Characterize mold and underfill material properties and correlate material behavior with process outcomes and package reliability • Collaborate with thermo-mechanical modeling teams to model solder joint reliability and predict package warpage • Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling • Work cross-functionally with design, reliability, thermal, and manufacturing teams from concept through high-volume production

🎯 Requisitos

• Strong experience in wafer level molding and underfill processes for advanced semiconductor packages including fan-out wafer level packaging (FOWLP), 2.5D, and chiplet architectures • Deep understanding of mold compound and underfill material science including epoxy resin systems, filler particle size and loading, cure chemistry, and how material properties drive thermo-mechanical package behavior • Experience with underfill dispense techniques (capillary, no-flow, mold underfill), flow and void characterization, bleed-out control, and cure process optimization including staged and snap cure profiles • Understanding of thermo-mechanical behavior driven by mold and underfill materials including CTE mismatch, warpage evolution through cure and reflow, delamination driving forces, and material-induced reliability risks • Hands-on experience with failure analysis of mold and underfill failures including cross-sections, SEM/EDS, CSAM, TGA, DSC, and DMA for material characterization and thermal cycling reliability evaluation • Ability to work with OSATs and material suppliers to develop, qualify, and transfer mold and underfill processes into production, including equipment setup and process control plans • Strong problem-solving skills with ability to debug mold and underfill yield and reliability issues in manufacturing environments, including DOE-driven process optimization • Preferred: Experience with underfill materials for III-V or photonics packaging including optically clear encapsulants and low-modulus underfills • Preferred: Experience with mold and underfill integration in advanced packaging architectures including 2.5D interposers, 3D stacking, chiplet assemblies, and CoWoS-like structures • Preferred: Familiarity with a broad bill of materials for advanced packaging encapsulation including clear adhesives and underfills for photonics, high-filler, low-CTE mold compounds for 2.5D interposer assemblies • Preferred: Experience developing mold and underfill solutions for high-power or high-TDP devices • Preferred: Exposure to thermo-mechanical modeling or collaboration with simulation teams • Preferred: Understanding of system-level interactions, including TIM application and cold plate interaction with wafer level molded wafer

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