Senior Manager, RF Design

Emploi pas sur LinkedIn

🕒 il y a 15 jours

🌲 Oregon – Distant

🌲 Oregon – Remote

💵 $138 900 - $182 280 / an

⏰ Temps Plein

🟠 Senior

✍️ Designer

🦅 Parrain de Visa H1B

Cette entreprise a parrainé des visas H1B par le passé.

👻 Score fantôme 11%

Ce que ça veut dire : la probabilité que cette offre reste ouverte sans recrutement actif.Comment le lire : 60 % ou plus, on pense que c'est une offre fantôme. Un score plus bas est moins inquiétant.Comment on la calcule : ancienneté, republications, postes ouverts vs taille de l'équipe, rapidité de clôture, et si le salaire est indiqué.À noter : une estimation à partir de données publiques, pas un jugement sur l'entreprise. De vraies offres peuvent avoir un score élevé, alors prenez-le comme un indice, pas comme un fait.

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Formfactor

Site WebLinkedInTous les Emplois

11 - 50 employés

💼 Conseil

📚 Éducation

🎯 Recrutement

Consulting • Education • Recruitment

Formfactor est une école de design de produits basée en Russie qui propose des programmes de formation pour les designers en herbe et expérimentés, y compris des parcours de garantie d'emploi et de développement de compétences. L'organisation offre des consultations de carrière, des évaluations de compétences, des programmes d'apprentissage sur mesure, et dispose d'une large communauté de designers. Leurs services sont destinés aux personnes cherchant à démarrer ou à avancer dans une carrière en design de produits.

Description

• Lead, coach, and develop a team of RF Probe Card Designers • Establish team goals, performance expectations, and individual development plans • Recruit, hire, mentor, and retain technical talent • Direct production design of RF and microwave probe card solutions • Provide technical leadership for complex RF probe card architectures, transmission line structures, and probe technologies • Improve RF probe card design methodologies, tools, rules, workflows, quality, scalability, automation, and productivity • Establish design metrics and use data-driven decision-making for process improvements • Drive design standardization, methodology development, design reuse, and best practices across product families and sites • Collaborate with engineering, operations, manufacturing, supply chain, quality, product management, and global customer teams • Balance resources across multiple complex development projects and ensure milestone and product-release completion • Provide project status, resource planning, and performance metrics to management • Drive transfer of new products from development into production design • Champion Design for Manufacturability and Design for Assembly principles • Lead technical investigations and corrective actions for customer-impacting issues • Establish robust SIOP processes with cross-functional leadership • Develop KPIs and continuous-improvement initiatives • Lead change management for design methodologies, rules, CAD tools, and engineering workflows

🎯 Exigences

• Bachelor's degree in Electrical Engineering, Physics, or related engineering discipline, or equivalent work experience • Minimum 8 years of experience in semiconductor test, RF product development, probe cards, advanced interconnect technologies, microelectronics, PCB design, or related industries • Minimum 3 years of engineering leadership, technical leadership, or people management experience • Minimum 10 years of related experience with a Bachelor's degree; or 8 years with a Master's degree; or a PhD with 5 years' experience; or equivalent work experience • Demonstrated success leading cross-functional development projects from concept through production release • Experience managing technical professionals and building high-performing teams • Experience in semiconductor wafer probe, RF test systems, or advanced packaging technologies • Experience leading global engineering teams and cross-site development activities • Strong understanding of RF, microwave, and high-speed electrical design principles • Experience with RF probe cards, RF interposers, test interfaces, substrates, or related semiconductor test hardware • Understanding of PCB, thin-film, ceramic, and advanced substrate technologies • Understanding of SMT manufacturing processes • Experience developing and implementing engineering design methodologies, standards, and best practices • Experience driving design automation and design productivity improvements • Working knowledge of DFMEA, PFMEA, Ishikawa, IS/IS NOT, root-cause analysis, and corrective action methodologies • Familiarity with Lean Manufacturing, Six Sigma, DOE, SPC, and Gage R&R principles • Excellent problem-solving and decision-making skills • Strong written and verbal communication skills

🏖️ Avantages

• Medical, dental, and vision insurance • Life insurance • Disability coverage • 401(k) with company match • Employee stock purchase plan (ESPP) • Paid time off • Quarterly profit-sharing bonuses • Flexible spending or savings accounts