Platform Architect, Server Infrastructure

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Phononic Inc

WebsiteLinkedInAll Job Openings

51 - 200 employees

Founded 2008

🔧 Hardware

🤝 B2B

⚡ Energy

💰 Series H - Phononic on 2023-01

Hardware • B2B • Energy

Phononic Inc. is a global leader in solid‑state thermoelectric cooling technology that develops compact, energy‑efficient, refrigerant‑free cooling devices and system kits for data centers, AI infrastructure, networking optics, GPUs/HBMs, and commercial cooling applications. The company pairs proprietary thermoelectric hardware with software-defined thermal controls (its Thermal Fabric) to deliver millisecond‑response, workload‑aware cooling that reduces throttling, extends hardware life, and improves energy efficiency across enterprise and industrial deployments. Phononic emphasizes sustainable, scalable cooling solutions and a large IP portfolio underpinning its products and reference designs.

📋 Description

• Define end-to-end thermal architecture strategies for GPU servers, optical interconnects, and CPO-based systems • Develop system-level approaches to balance performance, heat dissipation, reliability, and energy efficiency • Design and optimize solutions for: High-power GPUs and accelerators, Dense optical I/O (pluggable and co-packaged optics), Rack- and cluster-level thermal constraints • Optimize cooling strategies for high-density AI workloads and optical bandwidth scaling • Analyze and improve thermal resistance, junction temperatures, and cooling efficiency • Lead design and evaluation of advanced cooling approaches, including: Air cooling (high-performance heatsinks, airflow optimization), Liquid cooling (direct-to-chip, cold plates), Immersion cooling and emerging techniques • Architect thermal solutions for: High-speed optical transceivers (400G/800G/1.6T+), Co-packaged optics (CPO) integrated with switch or GPU ASICs • Collaborate with silicon photonics teams to co-design thermal-aware optical packaging architectures • Design GPU server platforms optimized for thermal efficiency, including: Multi-GPU configurations and interconnect density, Power delivery and cooling integration, Airflow and liquid loop design • Drive innovations in rack-level and data center-level cooling, including: High-density rack (>50–100kW) thermal strategies, Integration with facility cooling systems, Optimization for power usage effectiveness (PUE)

🎯 Requirements

• Required Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Physics, or related field • 8–12+ years of experience in system architecture, thermal engineering, or hardware platform design • Deep expertise in: Thermal management and cooling technologies for high-performance systems, GPU servers, AI/HPC infrastructure, or data center platforms, Optical interconnects and high-speed systems (1.6T+) • Strong understanding of: Heat transfer (conduction, convection, liquid cooling systems), Power density and thermal constraints in modern compute systems, Tradeoffs across performance, cooling, cost, and reliability • Preferred Experience working with hyperscalers or large-scale AI deployments • Experience with co-packaged optics (CPO) and silicon photonics thermal challenges • Hands-on design experience with: Liquid cooling systems and cold plate design, High-density rack and cluster cooling • Knowledge of: Optical module thermal constraints and reliability, Data center infrastructure (HVAC, liquid loops, facility integration)