Packaging Engineer – Materials

Job not on LinkedIn

🔥 9 hours ago

🏄 California, Massachusetts, +1 more states – Remote

🏄 California – Remote 🍂 Massachusetts – Remote 🤠 Texas – Remote

⏰ Full Time

🟡 Mid-level

🟠 Senior

👷🏻‍♀️ Engineer

👻 Ghost score 25%

What it means: the chance that no one is really hiring for this job.How to read it: 60% or higher means we think this is a ghost. Lower scores are less of a worry.How we score it: age, reposts, open roles vs team size, how fast jobs close, and whether pay is listed.Fine print: an estimate from public data, not a judgment of the company. Real jobs can score high, so treat it as a hint, not a fact.

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Volantis Semiconductor

WebsiteLinkedInAll Job Openings

2 - 10 employees

Founded 2022

🔧 Hardware

🤖 Artificial Intelligence

🤝 B2B

🔥 Funding within the last year

💰 $88M Series A on 2026-09

Hardware • Artificial Intelligence • B2B

Volantis Semiconductor is a hardware company building photonic interconnects (tiny optical waveguides on large substrates) for AI accelerators and datacenter memory pooling. Their technology extends optical reach roughly 100x compared with electrical interconnects, enabling rack-level fast-memory pools with much higher bandwidth and far larger capacity so inference of >10-trillion-parameter models can run at low, SRAM-like latencies. The company has raised an $88M Series A and is backed by investors including Sam Altman and Jeff Dean; its team includes people experienced in co‑packaged optics, HBM, and CoWoS. Volantis targets other hardware and infrastructure builders with photonic AI infrastructure components that reduce $/token and overcome the memory wall for large-model inference.

📋 Description

• Own wafer level molding and underfill processes, material qualification, and assembly integration across development and manufacturing • Lead wafer level mold and underfill process development for advanced semiconductor packages, including fan-out wafer level packaging, 2.5D/3D, and chiplet architectures • Develop and optimize compression molding, transfer molding, and mold underfill (MUF) processes • Select and qualify mold compounds and underfill materials based on filler content, CTE, modulus, Tg, viscosity, and moisture uptake • Develop capillary underfill dispense strategies, optimize flow and voids, and develop cure profiles for flip chip and chiplet assemblies • Evaluate and mitigate warpage, delamination, void formation, bleed-out, mold flash, and filler settling; define process windows and controls • Collaborate with OSATs and material suppliers to qualify materials, define dispense and cure equipment requirements, and transfer processes into production • Characterize mold and underfill material properties and correlate material behavior with process outcomes and package reliability • Collaborate with thermo-mechanical modeling teams to model solder joint reliability and predict package warpage • Support reliability qualification including thermal cycling, drop, mechanical shock, and power cycling • Work cross-functionally with design, reliability, thermal, and manufacturing teams from concept through high-volume production

🎯 Requirements

• Strong experience in wafer level molding and underfill processes for advanced semiconductor packages including fan-out wafer level packaging (FOWLP), 2.5D, and chiplet architectures • Deep understanding of mold compound and underfill material science including epoxy resin systems, filler particle size and loading, cure chemistry, and how material properties drive thermo-mechanical package behavior • Experience with underfill dispense techniques (capillary, no-flow, mold underfill), flow and void characterization, bleed-out control, and cure process optimization including staged and snap cure profiles • Understanding of thermo-mechanical behavior driven by mold and underfill materials including CTE mismatch, warpage evolution through cure and reflow, delamination driving forces, and material-induced reliability risks • Hands-on experience with failure analysis of mold and underfill failures including cross-sections, SEM/EDS, CSAM, TGA, DSC, and DMA for material characterization and thermal cycling reliability evaluation • Ability to work with OSATs and material suppliers to develop, qualify, and transfer mold and underfill processes into production, including equipment setup and process control plans • Strong problem-solving skills with ability to debug mold and underfill yield and reliability issues in manufacturing environments, including DOE-driven process optimization • Preferred: Experience with underfill materials for III-V or photonics packaging including optically clear encapsulants and low-modulus underfills • Preferred: Experience with mold and underfill integration in advanced packaging architectures including 2.5D interposers, 3D stacking, chiplet assemblies, and CoWoS-like structures • Preferred: Familiarity with a broad bill of materials for advanced packaging encapsulation including clear adhesives and underfills for photonics, high-filler, low-CTE mold compounds for 2.5D interposer assemblies • Preferred: Experience developing mold and underfill solutions for high-power or high-TDP devices • Preferred: Exposure to thermo-mechanical modeling or collaboration with simulation teams • Preferred: Understanding of system-level interactions, including TIM application and cold plate interaction with wafer level molded wafer

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