Senior OSAT Engineer

Job not on LinkedIn

🕒 June 3

🇹🇼 Taiwan – Remote

⏰ Full Time

🟠 Senior

👷🏻‍♀️ Engineer

👻 Ghost score 45%

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Altera

WebsiteLinkedInAll Job Openings

1001 - 5000 employees

Founded 1983

🏭 Manufacturing

📣 Marketing

🤖 Artificial Intelligence

Manufacturing • Marketing • Artificial Intelligence

Altera is a company focused on transforming the fashion industry through advanced technology and artificial intelligence. By utilizing AI, they enable businesses to create personalized clothing experiences, tailoring designs to individual customer preferences. Their approach enhances the online buying experience, improving customization options and transforming how designs are developed and marketed in the apparel sector.

📋 Description

• Lead technical engagement with OSAT suppliers on assembly and test process development, yield ramp, quality improvement, and volume manufacturing readiness. • Drive new product introduction (NPI) from engineering builds through production release, ensuring OSAT capability meets electrical/thermal/mechanical requirements for FPGA and SoC products. • Optimize packaging and test architectures for performance, cost, and reliability: advance packaging, flip-chip BGA, high-pin-count packages, substrate technologies, wafer-level solutions, burn-in/FT coverage. • Monitor and improve manufacturing performance using data-driven analysis; identify systemic issues and lead root cause / corrective actions. • Partner with Test Engineering, Package Design, Product Engineering, DFM, and Quality teams on process optimization, failure analysis, and manufacturability improvements. • Implement and maintain process control systems, SPC methodologies, automation improvements, and lean manufacturing principles at OSAT. • Support cost reduction initiatives including BOM optimization, process simplification, and cycle time improvements. • Track supplier performance metrics (yield, DPPM, cost, cycle time, OEE) and provide updates with risk assessments and mitigation plans. • Lead or support reliability testing and package qualification activities aligned to industry standards (JEDEC, IPC, AEC-Q). • Maintain strong technical relationship and communication cadence with OSAT partners to ensure transparency, collaboration, and escalation management.

🎯 Requirements

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, or related field • 10+ years of semiconductor assembly, packaging, or test engineering experience • Hands-on experience with OSAT manufacturing environments, including wafer finishing, substrate attach, interconnect packaging, test, and burn-in. • Strong technical understanding of backend manufacturing flows: flip-chip, wire bond, underfill, molding, final test, reliability stress and analysis. • Proven ability to analyze yield, reliability, and cost data to drive engineering decisions and improvements. • Demonstrated success working with international suppliers and cross-functional teams. • Strong statistical analysis, written and verbal communication skills, including technical reporting and supplier engagement.

🏖️ Benefits

• Health insurance • 401(k) matching • Flexible working hours • Paid time off • Remote work options

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