
201 - 500 employees
Founded 2005
🏭 Manufacturing
💼 Consulting
📦 Logistics
Manufacturing • Consulting • Logistics
SiTime is a leader in precision timing solutions, specializing in MEMS (Micro-Electro-Mechanical Systems) technology that provides superior timing devices used in various industries, including automotive, aerospace, and communications. Their innovative products enhance system performance, reduce size, and deliver unmatched reliability in harsh environments, making them indispensable in advanced applications such as 5G, IoT, and automotive electronics.
🔥 18 minutes ago
Where this job comes from
Posted on SiTime's careers page, not through a job board
First seen by Remote Rocketship 18 minutes ago

201 - 500 employees
Founded 2005
🏭 Manufacturing
💼 Consulting
📦 Logistics
Manufacturing • Consulting • Logistics
SiTime is a leader in precision timing solutions, specializing in MEMS (Micro-Electro-Mechanical Systems) technology that provides superior timing devices used in various industries, including automotive, aerospace, and communications. Their innovative products enhance system performance, reduce size, and deliver unmatched reliability in harsh environments, making them indispensable in advanced applications such as 5G, IoT, and automotive electronics.
• Develop, optimize, and characterize packaging processes for WLCSP technologies, including bumping, RDL formation, underfill, and dicing • Perform root cause analysis and implement corrective and preventive actions using 8D methodology • Collaborate with R&D, design, equipment, and manufacturing teams to transfer processes from development to high-volume manufacturing • Lead or participate in cross-functional new product introduction (NPI) and process improvement projects • Evaluate and qualify new materials, equipment, and processes for technology roadmaps and production requirements • Stay current with packaging technology trends and advancements • Conduct process capability analysis using Cp/Cpk • Implement SPC and continuous improvement initiatives to improve yield, quality, and cost-efficiency • Define and maintain process specifications, control plans, and SOPs • Provide technical support and training to manufacturing operators and technicians
• Experience or expertise in Bumping, Flip-chip, and Wafer-Level Chip Scale Packaging (WLCSP) technologies • Ability to develop, optimize, characterize, and sustain advanced packaging processes • Knowledge of bumping, re-distribution layer (RDL) formation, underfill, and dicing • Experience performing root cause analysis and implementing corrective and preventive actions using 8D methodology • Ability to conduct process capability analysis (Cp/Cpk) • Knowledge of statistical process control (SPC) • Ability to define and maintain process specifications, control plans, and standard operating procedures (SOPs) • Knowledge of materials and packaging/manufacturing equipment • Knowledge of safety and quality standards, including Good Manufacturing Practices (GMP) • Ability to provide technical support and training to manufacturing operators and technicians • Ability to collaborate with R&D, design, equipment, and manufacturing teams • Strong problem-solving, attention to detail, and technical communication skills
• Quarterly bonus tied to the achievement of innovation goals • Equity grants • Comprehensive and highly competitive compensation package
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