Principal Thermal Solutions Engineer

Job not on LinkedIn

🔥 1 minute ago

🇰🇷 South Korea – Remote

⏰ Full Time

🔴 Lead

💻 Solutions Engineer

👻 Ghost score 15%

What it means: the chance that no one is really hiring for this job.How to read it: 60% or higher means we think this is a ghost. Lower scores are less of a worry.How we score it: age, reposts, open roles vs team size, how fast jobs close, and whether pay is listed.Fine print: an estimate from public data, not a judgment of the company. Real jobs can score high, so treat it as a hint, not a fact.

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Vinci

WebsiteLinkedInAll Job Openings

51 - 200 employees

Founded 2023

🤖 Artificial Intelligence

🔧 Hardware

🤝 B2B

🔥 Funding within the last year

💰 $36M Series A on 2025-12

Artificial Intelligence • Hardware • B2B

Vinci is an AI-driven physics-simulation company (branded Vinci AI / Vinci4d) that provides full-manufacturing-resolution design and simulation tools for hardware engineering. Its core product is a physics AI foundation model that combines AI acceleration with FEA solver accuracy to run GPU-powered, full-fidelity simulations (no meshing or approximations) orders of magnitude faster than traditional solvers. Vinci targets semiconductor and hardware engineering teams, has been validated against commercial FEA tools and peer-reviewed studies, and positions itself as a B2B platform to embed physical reasoning throughout the hardware design lifecycle. The company also publicizes a major Series B raise and partnerships with institutional and strategic investors in the hardware and semiconductor industry.

📋 Description

• Build, lead, and scale a high-performing team of thermal engineers across Asia • Set technical direction, hire and mentor team members, and drive field execution • Collaborate with Sales to lead technical discussions, scope proof-of-concept evaluations, and deliver product demonstrations • Guide customer engineering teams through simulation setup, complex test cases, and interpretation of results • Demonstrate Vinci's technical and business value to prospective enterprise customers • Own customer onboarding, deployment pipeline, account expansion, training, and advanced troubleshooting • Identify customer pain points and workflow bottlenecks • Partner with Product and Engineering to turn field feedback into new product features • Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations • Maintain knowledge of competitive technologies, industry trends, and market positioning • Analyze thermal management systems, fluid flow dynamics, heat dissipation, steady-state and transient thermal behavior • Help customers evaluate thermal risk, component reliability, power density, and cooling efficiency

🎯 Requirements

• Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field • 15+ years of hands-on experience in thermal management and cooling solutions • Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent • Deep familiarity with semiconductor electronics packaging, advanced packaging technologies such as 2.5D/3D IC, or foundry ecosystems • Prior experience in dedicated customer-facing roles • Practical programming experience using Python or C++ to automate workflows or parse simulation data • Proven managerial or technical leadership experience • Elite interpersonal and communication skills • Professional fluency in Mandarin or Korean • Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows • Direct experience commercializing technical software, ideally EDA or CAE simulation tools, into major semiconductor and electronics enterprises • Prior experience in technical pre-sales, application engineering (FAE), or strategic technical sales environments • Ability to adopt and champion physics-based workflows and AI-assisted design or simulation tools

🏖️ Benefits

• Remote work arrangement • Moderate travel primarily within Asia • Infrequent intercontinental travel for collaboration with the US team • Collaboration with world-class engineers and researchers • Fast-moving startup environment • Opportunity to work at the convergence of AI, fundamental physics, and enterprise engineering • Opportunity to help redefine how next-generation hardware is designed

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