
51 - 200 employees
Founded 2023
đ€ Artificial Intelligence
đ§ Hardware
đ€ B2B
đ„ Funding within the last year
đ° $36M Series A on 2025-12
Artificial Intelligence âą Hardware âą B2B
Vinci is an AI-driven physics-simulation company (branded Vinci AI / Vinci4d) that provides full-manufacturing-resolution design and simulation tools for hardware engineering. Its core product is a physics AI foundation model that combines AI acceleration with FEA solver accuracy to run GPU-powered, full-fidelity simulations (no meshing or approximations) orders of magnitude faster than traditional solvers. Vinci targets semiconductor and hardware engineering teams, has been validated against commercial FEA tools and peer-reviewed studies, and positions itself as a B2B platform to embed physical reasoning throughout the hardware design lifecycle. The company also publicizes a major Series B raise and partnerships with institutional and strategic investors in the hardware and semiconductor industry.
đ„ 1 minute ago
đŁïžđšđł Chinese Required
đŁïžđ°đ· Korean Required
Where this job comes from
Posted on Vinci's careers page, not through a job board
First seen by Remote Rocketship 1 minute ago

51 - 200 employees
Founded 2023
đ€ Artificial Intelligence
đ§ Hardware
đ€ B2B
đ„ Funding within the last year
đ° $36M Series A on 2025-12
Artificial Intelligence âą Hardware âą B2B
Vinci is an AI-driven physics-simulation company (branded Vinci AI / Vinci4d) that provides full-manufacturing-resolution design and simulation tools for hardware engineering. Its core product is a physics AI foundation model that combines AI acceleration with FEA solver accuracy to run GPU-powered, full-fidelity simulations (no meshing or approximations) orders of magnitude faster than traditional solvers. Vinci targets semiconductor and hardware engineering teams, has been validated against commercial FEA tools and peer-reviewed studies, and positions itself as a B2B platform to embed physical reasoning throughout the hardware design lifecycle. The company also publicizes a major Series B raise and partnerships with institutional and strategic investors in the hardware and semiconductor industry.
âą Build, lead, and scale a high-performing team of thermal engineers across Asia âą Set technical direction, hire and mentor team members, and drive field execution âą Collaborate with Sales to lead technical discussions, scope proof-of-concept evaluations, and deliver product demonstrations âą Guide customer engineering teams through simulation setup, complex test cases, and interpretation of results âą Demonstrate Vinci's technical and business value to prospective enterprise customers âą Own customer onboarding, deployment pipeline, account expansion, training, and advanced troubleshooting âą Provide product guidance and customer feedback to Product and Engineering teams âą Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations âą Maintain knowledge of competitive technologies, industry trends, and market positioning
âą Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field âą Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent âą 15+ years of hands-on experience in thermal management and cooling solutions âą Deep familiarity with semiconductor electronics packaging, advanced packaging technologies such as 2.5D/3D IC, or foundry ecosystems âą Prior experience in dedicated customer-facing roles âą Practical programming experience using Python or C++ to automate workflows or parse simulation data âą Proven managerial or technical leadership experience âą Elite interpersonal and communication skills âą Professional fluency in Mandarin or Korean âą Familiarity with structural mechanical simulations, FEA/stress, and/or Electrical Signal Integrity and Power Integrity workflows is desirable âą Direct experience commercializing technical software, ideally EDA or CAE simulation tools, is desirable âą Prior technical pre-sales, application engineering, or strategic technical sales experience is desirable âą Ability to adopt and champion physics-based workflows and AI-assisted design or simulation tools is desirable
âą Moderate travel, primarily within Asia, with some infrequent intercontinental travel âą Collaboration with world-class engineers and researchers âą Fast-moving startup environment âą Opportunity to work at the convergence of AI models, fundamental physics, and enterprise engineering âą Opportunity to help redefine next-generation hardware design
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