Principal Thermal Solutions Engineer

Job not on LinkedIn

🔥 12 hours ago

🇹🇼 Taiwan – Remote

⏰ Full Time

🔴 Lead

💻 Solutions Engineer

👻 Ghost score 25%

What it means: how likely this posting is sitting open without active hiring.How to read it: 60% or higher means we think this is a ghost. Lower scores are less of a worry.How we score it: age, reposts, open roles vs team size, how fast jobs close, and whether pay is listed.Fine print: an estimate from public data, not a judgment of the company. Real jobs can score high, so treat it as a hint, not a fact.

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Vinci4D.ai

WebsiteLinkedInAll Job Openings

11 - 50 employees

🤖 Artificial Intelligence

Artificial Intelligence

Vinci4D. ai is an AI-focused company. Publicly available information is minimal (only a contact email, a jobs link, and a copyright notice), so exact products or services aren't disclosed. Based on the name and . ai domain, the company likely develops artificial intelligence solutions, potentially related to 4D data, visualization, or modeling, but that is speculative given the lack of detail.

📋 Description

• Build, lead, and scale a high-performing team of thermal engineers across Asia • Set technical direction, hire and mentor team members, and drive field execution • Collaborate with Sales to lead technical discussions, scope proof-of-concept evaluations, and deliver product demonstrations • Guide customer engineering teams through evaluation phases • Oversee simulation setup, run complex test cases, and interpret results to demonstrate technical and business value • Own customer onboarding, deployment pipeline, and account expansion • Provide senior technical guidance, structured training, and advanced troubleshooting • Identify customer pain points and workflow bottlenecks • Partner with Product and Engineering teams to convert field feedback into product features • Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations • Track competitive technologies, industry trends, and market positioning • Advise customers on thermal management systems, fluid flow dynamics, heat dissipation, thermal risk, component reliability, power density, and cooling efficiency

🎯 Requirements

• Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field • Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent • 15+ years of hands-on experience in thermal management and cooling solutions, either running simulations or serving as a technical account manager for commercial physics simulation software • Deep familiarity with semiconductor electronics packaging, advanced packaging technologies such as 2.5D/3D IC, or foundry ecosystems • Prior experience in dedicated customer-facing roles • Practical programming experience using Python or C++ to automate workflows or parse simulation data • Proven managerial or technical leadership experience • Ability to scale, mentor, and drive execution across engineering teams • Elite interpersonal and communication skills • Ability to distill complex physics and simulation results into clear narratives for technical panels and business-oriented executives • Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows • Direct experience commercializing technical software, ideally EDA or CAE simulation tools, into major semiconductor and electronics enterprises • Prior experience in technical pre-sales, application engineering (FAE), or strategic technical sales environments • Ability to rapidly adopt and champion physics-based workflows and AI-assisted design or simulation tools

🏖️ Benefits

• Moderate travel, primarily within Asia • Infrequent intercontinental travel may be required for discussions and collaboration with the US team • Collaboration with world-class engineers and researchers • Fast-moving startup environment • Opportunity to work at the convergence of AI models, fundamental physics, and hardware design