
501 - 1000 employees
🔧 Hardware
🤖 Artificial Intelligence
☁️ SaaS
Hardware • Artificial Intelligence • SaaS
Cerebras is a company that builds wafer-scale AI chips (the Wafer-Scale Engine) and systems purpose-built for ultra-fast AI inference and training. They offer the CS-3 system and Cerebras Inference Cloud with drop-in OpenAI API compatibility, enable on-premise, cloud, and edge deployment, and partner with companies like AMD, CrowdStrike, Flex, and major enterprises. Their product messaging emphasizes extremely large chips (58x larger than GPUs), massive speed and throughput (up to 15x faster inference, thousands of tokens per second), and use cases across model serving, fine-tuning, and pre-training. Customers include OpenAI, Meta, GSK, Mayo Clinic, AWS, and others; applications span AI infrastructure, real-time agents, genomics, drug discovery, cybersecurity, and enterprise search. Cerebras focuses on high-performance AI hardware and integrated software/platform offerings for training and inference.
🔥 4 hours ago
🇺🇸 United States – Remote
💵 $210k - $230k / year
⏰ Full Time
🟠 Senior
🧑💻 Full-stack Engineer
👻 Ghost score 0%
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501 - 1000 employees
🔧 Hardware
🤖 Artificial Intelligence
☁️ SaaS
Hardware • Artificial Intelligence • SaaS
Cerebras is a company that builds wafer-scale AI chips (the Wafer-Scale Engine) and systems purpose-built for ultra-fast AI inference and training. They offer the CS-3 system and Cerebras Inference Cloud with drop-in OpenAI API compatibility, enable on-premise, cloud, and edge deployment, and partner with companies like AMD, CrowdStrike, Flex, and major enterprises. Their product messaging emphasizes extremely large chips (58x larger than GPUs), massive speed and throughput (up to 15x faster inference, thousands of tokens per second), and use cases across model serving, fine-tuning, and pre-training. Customers include OpenAI, Meta, GSK, Mayo Clinic, AWS, and others; applications span AI infrastructure, real-time agents, genomics, drug discovery, cybersecurity, and enterprise search. Cerebras focuses on high-performance AI hardware and integrated software/platform offerings for training and inference.
• Own multilayer PCB layout from initial component placement through fabrication and assembly release • Translate schematics, mechanical constraints, and electrical requirements into constraint-driven board designs • Define and implement board stackups, controlled-impedance structures, routing rules, reference planes, return paths, and length- and phase-matching constraints • Place and route high-speed digital, high-current power, and sensitive analog circuits, including dense BGA fanout and differential interfaces • Apply signal-integrity and power-integrity best practices to minimize crosstalk, discontinuities, noise, voltage drop, and electromagnetic interference • Collaborate with electrical, SI/PI, mechanical, thermal, compliance, manufacturing, and test engineers • Work with fabrication and assembly partners to select materials, validate stackups and via structures, and improve yield, cost, and schedule • Perform design reviews and DFM, DFA, and DFT checks • Generate and verify fabrication drawings, assembly drawings, drill data, Gerbers, ODB++, IPC-2581, and related release packages • Maintain component footprints, padstacks, design libraries, layout standards, and release documentation • Support prototype builds, board bring-up, failure analysis, and layout revisions through production
• Bachelor’s degree in electrical engineering, electronics engineering, or a related field, or equivalent practical experience • 10+ years of hands-on experience laying out complex, high-speed, multilayer printed circuit boards • Expertise with Cadence Allegro PCB Designer and Constraint Manager • Experience with Altium Designer or equivalent tools • Strong knowledge of component placement, controlled-impedance routing, differential pairs, length matching, return-path continuity, and power distribution • Experience with dense BGA escape routing, HDI structures, blind and buried vias, microvias, via-in-pad, and backdrilling • Working knowledge of signal integrity, power integrity, EMI/EMC, thermal design, creepage and clearance, and high-current routing • Experience applying IPC standards and fabrication, assembly, test, and manufacturability requirements • Ability to create and review complete PCB fabrication and assembly release packages • Ability to thrive in a fast-paced, dynamic environment and adapt to changing priorities • Excellent collaborative and interpersonal skills with multi-disciplined teams • Experience working on server hardware, AI accelerators, hardware accelerator, datacenter, AI Hardware, or enterprise products • Preferred: experience designing large, high-layer-count boards for compute, networking, server, or AI accelerator systems • Preferred: experience routing DDR4/DDR5, PCIe Gen4/Gen5 or later, Ethernet, USB, and multi-gigabit SerDes • Preferred: experience with high-current, low-voltage power delivery, VRM placement, decoupling strategy, copper balancing, and thermal optimization • Preferred: experience developing Allegro SKILL, scripts, or automation • Preferred: success delivering first-pass functional boards and supporting products from prototype through volume production
• Bonus and equity may be included in actual compensation • Job stability with startup vitality • Simple, non-corporate work culture that respects individual beliefs • Opportunities to publish and open source cutting-edge AI research • Work on one of the fastest AI supercomputers in the world • Continuous learning, growth and support • Equal and diverse work environment
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