Principal ASIC Package Design Engineer

🔥 1 minute ago

🇺🇸 United States – Remote

💵 $200k - $280k / year

⏰ Full Time

🔴 Lead

🧑‍🔧 Mechanical Engineer

👻 Ghost score 21%

What it means: the chance that no one is really hiring for this job.How to read it: 60% or higher means we think this is a ghost. Lower scores are less of a worry.Why this score:

• Just posted.
• Jobs at this company usually fill in 55 days.
• 17 open roles for a team of 34.

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K2 Space Corporation

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11 - 50 employees

Founded 2022

🎖️ Defense

📦 Logistics

🏭 Manufacturing

Defense • Logistics • Manufacturing

K2 Space Corporation is a California-based aerospace manufacturer that designs and produces large, high-power satellite buses intended to deliver significantly more power, mass and payload volume at lower cost than traditional large satellites. The company emphasizes production-line style builds and commercial supply chains to shorten lead times and reduce per-unit cost, enabling multi-manifest launches and multi-orbit missions across LEO, MEO, GEO and cislunar space. K2 serves commercial, scientific and government/defense customers, and focuses on enabling missions that require high throughput, high-power payloads.

📋 Description

• Lead advanced ASIC package architecture and execution, focusing on FC-BGA and MCM solutions • Own end-to-end package strategy for high-performance mixed-signal and digital SoCs from early architecture and trade studies through vendor engagement, qualification, and production ramp • Serve as the technical authority for package design, defining standards and influencing silicon and system architecture • Own ASIC package architecture including substrate stack-up, ball-map strategy, power delivery, signal breakout, and mechanical constraints • Lead package-level trade studies across cost, performance, power integrity, signal integrity, thermal, manufacturability, and reliability • Define the long-term packaging roadmap aligned with future ASIC nodes, bandwidth scaling, and multi-die integration • Establish organizational package design standards, methodologies, and best practices • Drive detailed FC-BGA package design for high-pin-count ASICs with high-speed SerDes, dense power grids, and RF signal content • Define and review substrate stack-ups, via strategies, impedance control, escape routing, and reference plane planning • Partner with silicon, RF, and systems teams to co-optimize die floorplans and package interfaces • Own package-level SI/PI strategy for high-speed interfaces, PDN design, and decoupling strategy • Lead package-level thermal architecture, including lids, TIMs, heat-spreaders, and system cooling interfaces • Manage external packaging vendors, substrate suppliers, and OSATs, including qualification, capability assessment, contract negotiation, and performance/quality scorecarding • Drive material selection, substrate technology choices, and assembly process optimization

🎯 Requirements

• Bachelor’s degree in Packaging Engineering, Mechanical Engineering, Electrical Engineering, or a related field • 10+ years of experience in ASIC package design, with deep expertise in FC-BGA • Proven experience delivering high-pin-count, high-performance ASIC packages into production • Strong understanding of substrate technologies and materials, SI/PI fundamentals at the package level, and thermal management for power-dense ASICs • Fluent in SI/PI and EM simulation tools such as SIWave, HFSS, and ADS • Experience working directly with OSATs and substrate vendors • Knowledge of packaging qualification and test methodologies • The person hired must either be a “U.S. person” as defined by ITAR or otherwise eligible for a federally issued export control license

🏖️ Benefits

• Equity in the company • Paid time off • Medical coverage • Dental coverage • Vision coverage • Life insurance • Paid parental leave • Many other perks • Reasonable accommodation for employment applications or interviews

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