
5001 - 10000 employees
Founded 1985
đĄ Telecommunications
đ§ Hardware
đ° Series C on 1995-12
Telecommunications ⢠Hardware ⢠Networking
Ciena is a global leader in optical and routing systems, services, and automation software. We build the worldâs most adaptive networks to address ever-increasing digital demands for richer, more connected experiences for all users. For three-plus decades, weâve brought our innate sense of humanity to our relentless pursuit of innovation.
đĽ 4 minutes ago
đťđł Vietnam â Remote
â° Full Time
đĄ Mid-level
đ Senior
đ§ QA Engineer (Quality Assurance)
đť Ghost score 10%
đŁď¸đťđł Vietnamese Required
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5001 - 10000 employees
Founded 1985
đĄ Telecommunications
đ§ Hardware
đ° Series C on 1995-12
Telecommunications ⢠Hardware ⢠Networking
Ciena is a global leader in optical and routing systems, services, and automation software. We build the worldâs most adaptive networks to address ever-increasing digital demands for richer, more connected experiences for all users. For three-plus decades, weâve brought our innate sense of humanity to our relentless pursuit of innovation.
⢠Lead new product introduction activities from product transfer through process qualification, validation, manufacturing readiness, and production release ⢠Develop, qualify, and optimize semiconductor package assembly processes, including SMT, die attach, wire bond, flip-chip, dispensing, underfill, and backend assembly operations ⢠Drive BGA characterization, including stencil optimization, reflow profiling, DOE, BGA rework qualification, and assembly process validation ⢠Establish and maintain PFMEA, Control Plans, Process Flow Diagrams, work instructions, quality plans, and manufacturing process documentation ⢠Define process controls, SPC monitoring requirements, process capability targets, and CTQ characteristics ⢠Lead root cause investigations and corrective actions using 8D, DMAIC, DOE, 5-Why, and statistical analysis tools ⢠Support failure analysis using AXI, CT scan, cross-sectioning, EDX, dye-and-pry, and other analytical techniques ⢠Drive yield improvement, defect reduction, process optimization, and continuous improvement initiatives ⢠Manage non-conforming materials, containment activities, MRB reviews, corrective actions, and preventive action programs ⢠Support supplier quality activities, manufacturing partner audits, process qualifications, and customer quality requirements ⢠Serve as primary technical interface for manufacturing readiness reviews, process-related issues, and customer quality escalations ⢠Conduct DFM/DFX reviews and identify manufacturing risks to improve quality, yield, manufacturability, and operational efficiency ⢠Deliver successful new product introductions and manufacturing transfers ⢠Establish robust, scalable, and capable manufacturing processes ⢠Improve manufacturing yields and reduce defect rates ⢠Complete manufacturing readiness, qualification, and production milestones on time
⢠Bachelor's degree in Electrical Engineering, Electronics Engineering, Mechanical Engineering, Manufacturing Engineering, Materials Engineering, or a related discipline ⢠Hands-on experience supporting semiconductor package assembly processes, including flip-chip assembly, dam-and-fill, die attach, and wire bond technologies ⢠Strong experience with NPI, product transfer, process qualification, validation, and manufacturing readiness activities ⢠Experience with SMT assembly, BGA processes, reflow profiling, dispensing, underfill processes, and manufacturing process controls ⢠Knowledge of PFMEA, Control Plans, SPC, MSA, DOE, process capability studies, and yield improvement methodologies ⢠Strong analytical, problem-solving, communication, and technical documentation skills ⢠Ability to collaborate with engineering, manufacturing, suppliers, customers, and contract manufacturing partners ⢠Experience managing manufacturing quality and process-related issues in a high-technology manufacturing environment ⢠Six Sigma Green Belt, Black Belt, CQE, or equivalent quality certification ⢠Experience supporting advanced packaging technologies, including flip-chip assembly and large BGA characterization ⢠Experience utilizing failure analysis methods such as AXI, CT scan, cross-sectioning, EDX, and related diagnostic tools ⢠Experience working with EMS, ODM, or contract manufacturing partners ⢠Experience supporting optical, photonics, telecommunications, semiconductor, or high-reliability electronics manufacturing environments ⢠Knowledge of supplier quality systems, audits, qualification processes, and manufacturing excellence frameworks ⢠Preferred location: Vietnam ⢠Preferred languages: Vietnamese and English ⢠Chinese language capability is an additional advantage
⢠Flexible work environment ⢠Employee growth opportunities ⢠Well-being support ⢠Belonging-focused culture ⢠Community and societal impact initiatives
Apply Nowđ May 1
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đťđł Vietnam â Remote
đľ $2k - $3k / month
â° Full Time
đĄ Mid-level
đ Senior
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đťđł Vietnam â Remote
â° Full Time
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