Senior Packaging Engineer

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SiTime

WebsiteLinkedInAll Job Openings

201 - 500 employees

Founded 2005

🚀 Aerospace

Aerospace • Automotive • Communications & Enterprise

SiTime is a leader in precision timing solutions, specializing in MEMS (Micro-Electro-Mechanical Systems) technology that provides superior timing devices used in various industries, including automotive, aerospace, and communications. Their innovative products enhance system performance, reduce size, and deliver unmatched reliability in harsh environments, making them indispensable in advanced applications such as 5G, IoT, and automotive electronics.

📋 Description

• Develop, optimize, and characterize packaging processes for WLCSP technologies • Perform root cause analysis and implement corrective and preventive actions • Collaborate with R&D, design, equipment, and manufacturing teams for seamless process transfer • Lead or participate in cross-functional teams for new product introduction (NPI) and process improvement projects • Conduct process capability analysis and drive continuous improvement initiatives

🎯 Requirements

• Experience with Bumping, Flip-chip and Wafer-Level Chip Scale Packaging (WLCSP) technologies • Expertise in process optimization and sustaining advanced packaging processes • Ability to collaborate with R&D, design, equipment, and manufacturing teams • Skills in root cause analysis and 8D methodology • Experience in defining and maintaining process specifications, control plans, and standard operating procedures (SOPs)

🏖️ Benefits

• Comprehensive and highly competitive compensation package • Quarterly bonus tied to innovation goals • Equity grants