Senior Mechanical Packaging Engineer

🕒 May 6

🏢🏡 New York City – Hybrid

💵 $125.3k - $296.7k / year

⏰ Full Time

🟠 Senior

👷🏻‍♀️ Engineer

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Nokia

WebsiteLinkedInAll Job Openings

10,000+ employees

Founded 1865

📡 Telecommunications

🏢 Enterprise

💰 Post-IPO Debt on 2018-12

Telecommunications • Enterprise • Infrastructure

Nokia is a B2B technology innovation leader in networking, providing advanced network solutions to enterprises, service providers, and the public sector worldwide. The company focuses on creating networks that are secure, resilient, and capable of connecting people, machines, and devices globally. Nokia is advancing technologies like 5G, AI, and quantum-safe networks, and it collaborates extensively to drive technological innovation forward. Through its Nokia Bell Labs division, the company also leads in pioneering future technologies, aiming to transform digital potential across various industries.

📋 Description

• Lead Package Design and Architecture in collaboration with cross-functional teams and stakeholders to ensure package requirements are met. • Innovate designs, applying Design for Manufacturing principles and with an eye towards production volumes and cost targets. • Drive key technology development to enable next generation product design. • Perform FEA structural analysis, including linear, nonlinear and dynamic studies using software. • Perform thermal analysis, and coupled-physics involving thermal–structural, thermal-mechanical stress and thermo-electric analyses. • Own and maintain mechanical drawings and manufacturing documentation along with Bill of Materials for new products. • Plan and Drive prototype assembly builds to enable deliveries for early design validation. • Drive package debug activities during product validation and qualification. • Survey new materials and vendors for all Advanced Packaging activities. • Develop semiconductor and optical packaging processes in-house, or in close partnership with contract manufacturers.

🎯 Requirements

• Advanced Degree in Mechanical Engineering or similar field. • 5-8 years of extended experience in high-volume packaging of 2.5/3D packages. • Expertise in next generation advanced photonics packaging technologies. • Expertise in 3D CAD design, tolerance analysis, and Geometric Dimensioning and Tolerancing (GD&T) with SolidWorks or similar software. • Expertise in thermal and thermo-mechanical simulations using ANSYS or similar software. • Experience with package and process design/development from design to production. • Expertise in material properties and yield/failure mode analysis. • Experience with documentation of fabrication, inspection, and assembly processes. • Solid interpersonal, communication and problem-solving skills in order to interact with engineering staff, external vendors and contractors effectively. • Experience with metrology techniques such as SEM/XSEM, confocal microscopy, or acoustic imaging. • Expertise in materials property and process, yield analysis and enhancement, and failure mode and analysis. • Experience with Industry Test Standards, such as JEDEC, EIA, Telcordia, Mil-Std, etc.

🏖️ Benefits

• Corporate Retirement Savings Plan • Health and dental benefits • Short-term disability, and long-term disability • Life insurance, and AD&D – Company paid 2x base pay • Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child) • Paid time off for holidays and Vacation • Employee Stock Purchase Plan • Tuition Assistance Plan • Adoption assistance • Employee Assistance Program/Work Life Resource Program