Director – Field Application Engineering

🕒 May 20

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Axelera AI

WebsiteLinkedInAll Job Openings

51 - 200 employees

Founded 2021

🤖 Artificial Intelligence

🔧 Hardware

🏢 Enterprise

Artificial Intelligence • Hardware • Enterprise

Axelera AI is a leading provider of AI hardware acceleration technology tailored for generative AI and computer vision inference. The company offers advanced AI processing units designed to integrate seamlessly into innovations, focused on delivering high-performance, cost-effective, and energy-efficient AI solutions. Axelera AI's flagship product, the Metis AI Processing Unit, accelerates inference at the edge, making it ideal for applications like video analysis and multi-channel video analytics. The company is recognized for its deep tech innovations and is actively contributing to the advancement of AI by providing state-of-the-art AI acceleration capabilities for edge computing.

📋 Description

• Senior primary technical contact for Taiwan customers, engaging from engineers to senior leadership • Lead hardware bring-up, board integration, and embedded system debugging on-site and remotely • Support chip-down design, custom carrier board development, and embedded Linux integration • Guide customers deploying AI models and inference pipelines via the Voyager SDK • Debug PCIe, power sequencing, signal integrity, thermal, and BSP bring-up issues • Drive pre-sales engagement and design wins across OEM/ODM, integrators, and end users • Build FAE processes, documentation, and support infrastructure for the Taiwan region • Recruit, mentor, and manage APAC FAE engineers as the team scales • Align priorities with commercial goals; contribute to APAC and global FAE strategy • Surface customer feedback and roadmap input to Product Management and R&D • Maintain relationships with key accounts, distributors, and channel partners in Taiwan • Partner with Sales and BD on product introductions, onboarding, and competitive intelligence

🎯 Requirements

• Master’s degree in Electrical Engineering, Computer Engineering, Embedded Systems, or related field • 10+ years customer-facing FAE or applications engineering in semiconductor, AI, or embedded systems • 5+ years leading FAE teams or managing technical customer-facing functions • Strong experience with embedded board design, chip-down development, and custom carrier board design • Experience with ARM-based SoCs and embedded compute modules • Strong understanding of high-speed digital interfaces, signal integrity, power sequencing, and thermal design • Experience with embedded Linux, bootloaders, BSPs, and low-level system bring-up • Proven ability to debug complex hardware/software integration issues • Familiarity with AI accelerators, NPUs, GPUs, or edge AI platforms • Commercial mindset; track record driving design wins through full evaluation and adoption cycles • Excellent English communication skills; ability to travel within Taiwan and occasionally APAC.

🏖️ Benefits

• Director-level role with real ownership and a clear path to regional team leadership • Work at the frontier of edge AI hardware with direct access to world-class R&D • Remote-first, Taiwan-based role within an established and growing local team • Collaborative international culture valuing technical depth, customer focus, and execution • Attractive compensation package, including a pension plan, extensive employee insurances and the option to get company shares.