ASIC Package Engineer

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March 6

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Axiom Software Solutions Limited

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IT Services • Software Development • Consulting

Axiom Software Solutions Limited is a global information technology, consulting, and outsourcing company headquartered in London, UK, with offices in Noida, India. With over 20 years of IT experience, Axiom specializes in delivering digital solutions, technology consulting, and recruitment services across various industries including Banking & Financials, Healthcare, and Media & Telecom. Their expertise includes a wide range of technologies such as SAP, Oracle, Salesforce, and AWS, providing clients with tailored IT solutions to enhance operational efficiency and achieve business goals. Axiom prides itself on its ability to deliver cost-effective, adaptable solutions and has a significant track record of success with a wide professional network and talent pool to support diverse global needs.

201 - 500 employees

📋 Description

•Experienced ASIC Packaging Engineer, Signal Integrity, and Power Integrity focus for its ASIC packaging team to support the development of custom ASICs. •Drive chip-package-system co-design by driving signal and power integrity requirements analysis and optimization •Define power tree structure, netlists, etc for High Performance Computing based on 2.5D/3D package technology •Run pre-layout and post-layout simulation flow with a focus on high-speed interface and PDN, create simulation models and develop simulation methodology for SIPI. •Develop SIPI validation methodology and develop detailed engineering test plans •Validate high speed interface and PDN impedance in lab to correlate simulation results and improve design flow •Work closely with Architecture, ASIC, Mixed Signal, Package, and PCB Design teams to design and ensure package/system SI/PI performance meets expectation before Gerber out, also work closely with Design Validation teams to support SI/PI failure analysis •Package/Board power delivery network AC+DC simulation for low-voltage/high-current supplies. •Development of next generation memory interface considering Input/Output Physical Layer (IO PHY), SI/PI and physical design.

🎯 Requirements

•Bachelor or Master degree in Electrical Engineering, Physics, Mathematics, or related field (or equivalent experience) •5+ years of experience in SIPI simulation and validation areas •Experience with high-speed interface protocols such as MIPI, PCIe, memory, HBM and USB. •Experience using Cadence Sigrity, PowerSI, Ansys SIwave, Keysight ADS, 3D layout and Ansys HFSS •Experience with consumer hardware design, review and bring-up process, CAD tools, constraint manager etc. •Solid understanding and experience in computational electromagnetics and transmission line theory.