Assembly and Packaging Process Engineer

Job not on LinkedIn

🕒 March 18

🌐 Taiwan, Singapore – Remote

🇹🇼 Taiwan – Remote 🇸🇬 Singapore – Remote

⏰ Full Time

🟢 Junior

👷🏻‍♀️ Engineer

👻 Ghost score 65%

What it means: how likely this posting is sitting open without active hiring.How to read it: 60% or higher means we think this is a ghost. Lower scores are less of a worry.How we score it: age, reposts, open roles vs team size, how fast jobs close, and whether pay is listed.Fine print: an estimate from public data, not a judgment of the company. Real jobs can score high, so treat it as a hint, not a fact.

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Lyte

WebsiteLinkedInAll Job Openings

51 - 200 employees

💰 $5M Series B - Lyte on 2021-01

Lyte is a company — no additional information was provided, so its business model, products, and industries cannot be determined from the input. Unable to produce a detailed description without more company text or context.

📋 Description

• Support device packaging process improvements for NPI and volume manufacturing with OSATs in Asia • Support optical engine and subcomponent assembly and process improvement for NPI and volume manufacturing with contract manufacturers in Asia • Track projects weekly • Write technical reports and present results • Analyze data and track OSAT, assembly house, and contract manufacturer Cp and Cpk for internal use • Support component-level CoC, device-level, optical engine, and module-system assembly testing and reliability work • Maintain software and firmware support for testing and relevant setups

🎯 Requirements

• Entry or middle level assembly and packaging engineer • Bachelor's degree in Electrical Engineering, Photonics, Mechanical Engineering, or a related field • Minimum 1 year of experience • English communication capability • Experience or knowledge of PCB assembly with SMT line • Hands-on experience in laboratory experimentation and data analysis • Familiarity with Microsoft Office • Fast learner • Good work ethics • Ability to maintain company confidential information • Experience or knowledge of microelectronic device packaging, optical device packaging, photonic and electronic device/component testing, and relevant device test areas is preferred • Knowledge of IIIV or CMOS wafer-level processes, IIIV bar-level processes, die attach, flip chip, wire bonding, and module mechanical assembly processes is preferred • SolidWorks and engineering drawing experience is a plus • Data analysis experience such as JMP is a plus; Excel is acceptable • Programming and software maintenance skills, such as Python or C++, are desired • Understanding of microelectronic and mechanical reliability tests is desirable • Experience in microsystem assembly, such as hard disk assembly, is a plus

🏖️ Benefits

• Competitive salary and equity • Comprehensive medical, dental, and vision coverage • 401(k) retirement plan • Flexible vacation and time-off policy • Collaborative, fast-paced, and inclusive work environment • Opportunity to work on cutting-edge technologies with a highly cross-functional team