Assembly and Packaging Process Engineer

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🕒 March 18

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Lyte

WebsiteLinkedInAll Job Openings

51 - 200 employees

💰 $5M Series B - Lyte on 2021-01

Lyte is a company — no additional information was provided, so its business model, products, and industries cannot be determined from the input. Unable to produce a detailed description without more company text or context.

📋 Description

• Work with OSAT in Asia to support company device packaging process improvements for NPI and volume manufacture • Work with CMs (contract manufactures) in Asia to support optical engine and subcomponent assembly and process improvement for NPI and volume manufacture • Project tracking weekly • Write technical reports and present results • Analyze data and track OSATs, Assembly houses, contract manufacturers Cp and Cpk for internal use • Support tests and reliability work at component level CoC, device level, optical engine, and module system assembly • Maintain the software and firmware support for testing and relevant setups

🎯 Requirements

• Minimal requirement is a bachelor's degree with 1 years of experience • English communication capability is a must • Experience or knowledge of PCB assembly with SMT line • Hands-on experience in laboratory experimentation and data analysis • Familiar with Microsoft Office • Fast learner is a must • Good work ethics and maintain company confidential information are a must • Higher degree with more experience is highly desired • Experience with microelectronic device packaging • Former experience of optical device packaging is highly desirable • Experience with hands-on testing of photonic and electronic device/components • Device test knowledge and experience for at least some following areas: IIIV CoC, wafer level probe test, packaged electro-optical devices, assembly modules, PCBA • Knowledge and experience in at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly. • Experience in SolidWorks and familiar with Engineering drawing is a plus • Data analysis experience such as JMPs is a plus; excel is OK • Programming and software maintenance skills are desired e.g. python or C++ • Understanding the microelectronic reliability tests and mechanical reliability tests are desirable • Experience in microsystem assembly such as hard disk assembly is a plus

🏖️ Benefits

• Competitive salary and equity • Comprehensive medical, dental, and vision coverage • 401(k) retirement plan • Flexible vacation and time-off policy • Collaborative, fast-paced, and inclusive work environment • Opportunity to work on cutting-edge technologies with a highly cross-functional team