Senior Principal Applications Engineer

🕒 April 3

🚗 Michigan – Remote

🚗 Michigan – Remote

⏰ Full Time

🟠 Senior

💻 Application Engineer

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NXP Semiconductors

WebsiteLinkedInAll Job Openings

10,000+ employees

Founded 2006

🔧 Hardware

💰 Post-IPO Debt on 2025-01

Hardware • Automotive • IoT

NXP Semiconductors is a global semiconductor company that provides innovative solutions for automotive, Internet of Things (IoT), and industrial applications. They specialize in microcontrollers, secure processors, and wireless connectivity, aiming to drive advancements in smart technologies and applications across various sectors. NXP's focus includes intelligent edge computing, secure authentication, and automotive technologies to meet the evolving needs of consumers and industries.

📋 Description

• Collaborate with IC design, systems, FW, and test teams to translate field issues and customer requirements into product improvements and new features. • Review customer schematics and layouts for signal‑integrity and power‑integrity best practices (impedance control, terminations, return paths, via design, reference plane strategy). • Lead board‑level bring‑up and validation using oscilloscopes, protocol analyzers; generate test reports and recommendations. • Provide on‑site or remote debug support for complex customer issues. • Develop and maintain application collateral: reference designs, layout guidelines, design checklists, characterization reports, application notes, training materials. • Participate in trade shows and provide FAE training.

🎯 Requirements

• Bachelor’s degree or above in Electrical/Electronic Engineering or related field. • Extensive experience (7+ years) in hardware design, applications engineering, or system validation. • Strong understanding of high-speed SerDes fundamentals: channel loss, reflections, return loss, insertion loss, ISI, jitter, equalization, and clocking. • Demonstrated experience with multi-Gbps serial links (e.g., Ethernet, PCIe, DP, USB3.x/USB4, proprietary SerDes). • Proficiency with SI/PI tools and simulations (e.g., S-parameter analysis, eye/jitter simulations) and comfort interpreting simulation and measurement correlation. • Hands-on experience using lab equipment: high-bandwidth oscilloscopes, TDR, VNA, BERT, protocol analyzers, logic analyzers, and related tools. • Strong skills in PCB design for high-speed: layer stack-up, routing constraints, differential pairs, reference planes, decoupling, and power delivery. • Excellent communication and presentation skills to explain complex technical topics to both expert and non-expert audiences. • Ability to work effectively with global, cross-functional teams (design, systems, test, marketing, field).

🏖️ Benefits

• Career Development Opportunities • Online and offline learning opportunities