
51 - 200 employees
Founded 2023
đ¤ Artificial Intelligence
đ§ Hardware
đ¤ B2B
đĽ Funding within the last year
đ° $36M Series A on 2025-12
Artificial Intelligence ⢠Hardware ⢠B2B
Vinci is an AI-driven physics-simulation company (branded Vinci AI / Vinci4d) that provides full-manufacturing-resolution design and simulation tools for hardware engineering. Its core product is a physics AI foundation model that combines AI acceleration with FEA solver accuracy to run GPU-powered, full-fidelity simulations (no meshing or approximations) orders of magnitude faster than traditional solvers. Vinci targets semiconductor and hardware engineering teams, has been validated against commercial FEA tools and peer-reviewed studies, and positions itself as a B2B platform to embed physical reasoning throughout the hardware design lifecycle. The company also publicizes a major Series B raise and partnerships with institutional and strategic investors in the hardware and semiconductor industry.
đĽ 1 minute ago
đ¸đŹ Singapore â Remote
đľ $110k - $140k / year
â° Full Time
đ´ Lead
đť Solutions Engineer
đť Ghost score 0%
đŁď¸đ¨đł Chinese Required
đŁď¸đ°đˇ Korean Required
Where this job comes from
Posted on Vinci's careers page, not through a job board
First seen by Remote Rocketship 1 minute ago

51 - 200 employees
Founded 2023
đ¤ Artificial Intelligence
đ§ Hardware
đ¤ B2B
đĽ Funding within the last year
đ° $36M Series A on 2025-12
Artificial Intelligence ⢠Hardware ⢠B2B
Vinci is an AI-driven physics-simulation company (branded Vinci AI / Vinci4d) that provides full-manufacturing-resolution design and simulation tools for hardware engineering. Its core product is a physics AI foundation model that combines AI acceleration with FEA solver accuracy to run GPU-powered, full-fidelity simulations (no meshing or approximations) orders of magnitude faster than traditional solvers. Vinci targets semiconductor and hardware engineering teams, has been validated against commercial FEA tools and peer-reviewed studies, and positions itself as a B2B platform to embed physical reasoning throughout the hardware design lifecycle. The company also publicizes a major Series B raise and partnerships with institutional and strategic investors in the hardware and semiconductor industry.
⢠Build, lead, and scale a high-performing team of thermal engineers across Asia ⢠Set technical direction, hire and mentor team members, and drive field execution ⢠Collaborate with sales to lead technical discussions, scope proof-of-concept evaluations, and deliver product demonstrations ⢠Oversee simulation setup, run complex test cases, and interpret results to prove technical and business value ⢠Own customer onboarding, deployment pipeline, account expansion, training, and advanced troubleshooting ⢠Identify customer pain points and workflow bottlenecks ⢠Partner with product and engineering teams to turn customer feedback into new product features ⢠Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations ⢠Track competitive technologies, industry trends, and market positioning ⢠Analyze thermal management systems, fluid flow dynamics, heat dissipation, and steady-state and transient thermal behavior ⢠Evaluate thermal risk, component reliability, power density, and cooling efficiency
⢠Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field ⢠Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent ⢠15+ years of hands-on experience in thermal management and cooling solutions ⢠Deep familiarity with semiconductor electronics packaging, advanced packaging technologies (e.g., 2.5D/3D IC), or foundry ecosystems ⢠Prior experience in dedicated customer-facing roles ⢠Practical programming experience using Python or C++ to automate workflows or parse simulation data ⢠Proven prior managerial or technical leadership experience ⢠Elite interpersonal and communication skills ⢠Professional fluency in Mandarin or Korean ⢠Familiarity with structural mechanical simulations (FEA/stress) and/or Electrical Signal Integrity and Power Integrity (SI/PI) workflows ⢠Direct experience commercializing technical software, ideally EDA or CAE simulation tools, into major semiconductor and electronics enterprises ⢠Prior experience in technical pre-sales, application engineering (FAE), or strategic technical sales environments ⢠Ability to adopt and champion physics-based workflows and AI-assisted design or simulation tools
⢠Remote work ⢠Moderate travel, primarily within Asia ⢠Collaboration with world-class engineers and researchers ⢠Fast-moving startup environment ⢠Opportunity to work at the convergence of AI models, fundamental physics, and enterprise engineering ⢠Opportunity to help redefine next-generation hardware design
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