
11 - 50 employees
đ€ Artificial Intelligence
Artificial Intelligence
Vinci4D. ai is an AI-focused company. Publicly available information is minimal (only a contact email, a jobs link, and a copyright notice), so exact products or services aren't disclosed. Based on the name and . ai domain, the company likely develops artificial intelligence solutions, potentially related to 4D data, visualization, or modeling, but that is speculative given the lack of detail.
đ„ 14 hours ago
đ«đ· France â Remote
đ” âŹ120k - âŹ130k / year
â° Full Time
đŽ Lead
đ» Solutions Engineer
đ» Ghost score 24%
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11 - 50 employees
đ€ Artificial Intelligence
Artificial Intelligence
Vinci4D. ai is an AI-focused company. Publicly available information is minimal (only a contact email, a jobs link, and a copyright notice), so exact products or services aren't disclosed. Based on the name and . ai domain, the company likely develops artificial intelligence solutions, potentially related to 4D data, visualization, or modeling, but that is speculative given the lack of detail.
âą Build, lead, and scale a high-performing team of thermal engineers across Europe âą Set technical direction, hire and mentor team members, and drive field execution âą Collaborate with Sales on technical discussions, PoC scoping, and product demonstrations âą Guide customer engineering teams through simulation setup, complex test cases, and results interpretation âą Demonstrate Vinciâs technical and business value âą Own customer onboarding, deployment pipeline, and account expansion âą Provide senior technical guidance, structured training, and advanced troubleshooting âą Identify customer pain points and workflow bottlenecks âą Partner with Product and Engineering to turn customer feedback into product features âą Represent Vinci at industry conferences and semiconductor events through technical presentations and live demonstrations âą Track competitive technologies, industry trends, and market positioning âą Help customers evaluate thermal risk, component reliability, power density, and cooling efficiency for next-generation hardware
âą Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field âą Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent âą 15+ years of hands-on experience in thermal management and cooling solutions âą Deep familiarity with semiconductor electronics packaging, advanced packaging technologies such as 2.5D/3D IC, or foundry ecosystems âą Prior experience in dedicated customer-facing roles âą Practical programming experience using Python or C++ to automate workflows or parse simulation data âą Proven managerial or technical leadership experience âą Ability to scale, mentor, and drive execution across engineering teams âą Elite interpersonal and communication skills âą Preferred: familiarity with structural mechanical simulations (FEA/stress) and/or SI/PI workflows âą Preferred: direct experience commercializing technical software, ideally EDA or CAE simulation tools âą Preferred: prior technical pre-sales, application engineering (FAE), or strategic technical sales experience âą Preferred: ability to adopt and champion physics-based and AI-assisted design or simulation tools
âą Remote work âą Moderate travel primarily within continental Europe âą Infrequent intercontinental travel for US-team collaboration âą Collaboration with world-class engineers and researchers âą Fast-moving startup environment âą Work at the convergence of state-of-the-art AI, fundamental physics, and high-stakes enterprise hardware design
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