
51 - 200 employees
Founded 2016
🤖 Artificial Intelligence
🔧 Hardware
💳 Fintech
Artificial Intelligence • Hardware • Fintech
Tenstorrent is a cutting-edge technology company based in Santa Clara, CA, specializing in AI semiconductors and computing solutions. They have developed advanced products like the TT-QuietBox, a liquid-cooled workstation designed for AI model development, and the Tenstorrent Galaxy, a high-performance AI compute server. Recently, Tenstorrent secured over $693M in Series D funding to enhance its AI chip capabilities and challenge market leaders in the AI data center sector.
🕒 March 18
🇺🇸 United States – Remote
💵 $100k - $500k / year
⏰ Full Time
🟡 Mid-level
🟠 Senior
🧑🔧 Mechanical Engineer
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51 - 200 employees
Founded 2016
🤖 Artificial Intelligence
🔧 Hardware
💳 Fintech
Artificial Intelligence • Hardware • Fintech
Tenstorrent is a cutting-edge technology company based in Santa Clara, CA, specializing in AI semiconductors and computing solutions. They have developed advanced products like the TT-QuietBox, a liquid-cooled workstation designed for AI model development, and the Tenstorrent Galaxy, a high-performance AI compute server. Recently, Tenstorrent secured over $693M in Series D funding to enhance its AI chip capabilities and challenge market leaders in the AI data center sector.
• Lead Die-to-Die (D2D) physical implementation and closure, taking high-speed D2D PHYs/controllers from netlist to tapeout. • Own the full PD flow (RTL-to-GDSII): synthesis, floorplanning, P&R, CTS, optimization, and sign-off. • Drive timing and verification, including full STA (setup/hold), SI analysis (crosstalk, IR drop), and achieving sign-off quality DRC/LVS. • Improve and maintain physical design methodologies, flows, and automation scripts (Tcl, Python), with specific focus on D2D routing, power grid design, and timing closure. • Partner closely with full-chip/chiplet teams to meet all tapeout requirements and with the analog design team to resolve interface issues (LEF/LIB, constraints, integration/debug). • Apply strong EDA tool expertise across Synopsys/Cadence/Mentor for implementation, analysis, and verification.
• A seasoned ASIC Physical Design Engineer with 5+ years at advanced nodes (7nm or below) and multiple successful tapeouts. • Strong in full-chip implementation, comfortable owning blocks from RTL to GDSII across synthesis, floorplanning, place-and-route, CTS, and sign-off. • Deeply familiar with high-speed interfaces (D2D, PCIe, HBM, SerDes) and the physical challenges that come with them (timing, signal integrity, power integrity). • Detail-oriented and methodical with STA, constraints, and closure for complex, high-speed designs. • A hands-on problem solver who enjoys collaborating across analog, digital, and full-chip teams to debug tough issues.
• Highly competitive compensation package • Health insurance • Professional development opportunities • Equal opportunity employer
Apply Now🕒 March 18
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