Principal Thermal Solutions Engineer

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🔥 0 minutes ago

🇩🇪 Germany – Remote

💵 €120k - €130k / year

⏰ Full Time

🔴 Lead

💻 Solutions Engineer

👻 Ghost score 0%

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Vinci

WebsiteLinkedInAll Job Openings

51 - 200 employees

Founded 2023

🤖 Artificial Intelligence

🔧 Hardware

🤝 B2B

🔥 Funding within the last year

💰 $36M Series A on 2025-12

Artificial Intelligence • Hardware • B2B

Vinci is an AI-driven physics-simulation company (branded Vinci AI / Vinci4d) that provides full-manufacturing-resolution design and simulation tools for hardware engineering. Its core product is a physics AI foundation model that combines AI acceleration with FEA solver accuracy to run GPU-powered, full-fidelity simulations (no meshing or approximations) orders of magnitude faster than traditional solvers. Vinci targets semiconductor and hardware engineering teams, has been validated against commercial FEA tools and peer-reviewed studies, and positions itself as a B2B platform to embed physical reasoning throughout the hardware design lifecycle. The company also publicizes a major Series B raise and partnerships with institutional and strategic investors in the hardware and semiconductor industry.

📋 Description

• Build, lead, and scale a high-performing team of thermal engineers across Europe • Set technical direction, hire and mentor team members, and drive field execution • Collaborate with Sales to lead technical discussions, scope PoC evaluations, and deliver product demonstrations • Guide customer engineering teams through simulation setup, complex test cases, and results interpretation • Own customer onboarding, deployment pipeline, account expansion, training, and advanced troubleshooting • Identify customer pain points and workflow bottlenecks • Partner with Product and Engineering to translate customer feedback into product features • Represent Vinci at industry conferences and semiconductor events through presentations and live demonstrations • Track competitive technologies, industry trends, and market positioning • Analyze thermal management systems, fluid flow dynamics, heat dissipation, steady-state and transient thermal behavior, thermal risk, component reliability, power density, and cooling efficiency

🎯 Requirements

• Degree in Mechanical Engineering, Electrical Engineering, or a closely related technical field • 15+ years of hands-on experience in thermal management and cooling solutions • Expert-level mastery of commercial simulation software such as Flotherm, Ansys Icepak/Fluent, Simcenter STAR-CCM+, or equivalent • Deep familiarity with semiconductor electronics packaging, advanced packaging technologies, or foundry ecosystems • Prior experience in dedicated customer-facing roles • Practical programming experience using Python or C++ to automate workflows or parse simulation data • Proven managerial or technical leadership experience • Elite interpersonal and communication skills • Familiarity with structural mechanical simulations and/or Electrical Signal Integrity and Power Integrity workflows is desirable • Direct experience commercializing technical software is desirable • Prior technical pre-sales, application engineering, or strategic technical sales experience is desirable • Ability to adopt and champion physics-based workflows and AI-assisted design or simulation tools is desirable

🏖️ Benefits

• Remote work arrangement • Moderate travel within continental Europe • Collaboration with world-class engineers and researchers • Fast-moving startup environment

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