Product Marketing Manager – Thermal Control, Semiconductor, AI & Data Center Infrastructure

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Phononic Inc

WebsiteLinkedInAll Job Openings

51 - 200 employees

Founded 2008

🔧 Hardware

🤝 B2B

⚡ Energy

💰 Series H - Phononic on 2023-01

Hardware • B2B • Energy

Phononic Inc. is a global leader in solid‑state thermoelectric cooling technology that develops compact, energy‑efficient, refrigerant‑free cooling devices and system kits for data centers, AI infrastructure, networking optics, GPUs/HBMs, and commercial cooling applications. The company pairs proprietary thermoelectric hardware with software-defined thermal controls (its Thermal Fabric) to deliver millisecond‑response, workload‑aware cooling that reduces throttling, extends hardware life, and improves energy efficiency across enterprise and industrial deployments. Phononic emphasizes sustainable, scalable cooling solutions and a large IP portfolio underpinning its products and reference designs.

📋 Description

• Develop differentiated messaging for thermal control systems for AI products (e.g., GPUs, ASICs, AI accelerators, SoCs, CPO, pluggable transceivers) • Articulate value across performance, power efficiency, and thermal design considerations • Translate complex concepts such as optical transceiver laser thermal control, AI server and GPU cooling, rack density, cooling requirements, and energy efficiency into customer-impact narratives • Lead launches of silicon and AI platform solutions optimized for high-density, thermally constrained environments • Develop GTM strategies that highlight performance-per-watt, cooling efficiency, and infrastructure readiness • Partner with product and engineering teams on positioning tied to data center scalability and sustainability • Analyze trends across AI infrastructure, high-performance computing (HPC), and data center thermal management • Track competitive approaches to liquid cooling, immersion cooling, advanced air cooling, and energy-efficient architectures • Develop insights on how competitors address heat density, power consumption, and AI cluster scaling challenges • Equip sales teams with materials explaining thermal tradeoffs, rack-level constraints, and cooling requirements • Develop tools to communicate TCO, power usage effectiveness (PUE), and data center operational efficiency • Collaborate with ecosystem partners including data center operators, cloud providers, and cooling and infrastructure vendors (e.g., liquid cooling solutions) • Create content on AI infrastructure challenges, including power delivery, cooling, and scaling constraints • Publish whitepapers and technical briefs on AI workload-driven thermal demands, cooling technologies (liquid cooling, immersion, direct-to-chip), sustainable AI infrastructure, etc. • Represent the company in discussions on AI data center design and efficiency trends

🎯 Requirements

• Required Bachelor’s degree in Electrical Engineering, Computer Science, Mechanical Engineering, or related field (MBA a plus) • 5+ years in product marketing, technical marketing, or product management in: • Semiconductors • AI/ML platforms • Data center infrastructure • Strong understanding of AI workloads (training vs. inference), compute architectures (GPU/CPU/ASIC), and power and thermal constraints in high-performance systems • Ability to translate technical topics such as heat dissipation, cooling architectures, and energy efficiency into business value • Excellent communication and storytelling skills • Preferred Experience with AI data center infrastructure, hyperscale environments, or HPC systems • Knowledge of thermal management and cooling technologies • Familiarity with infrastructure design tradeoffs for large-scale AI clusters • Background working with cloud providers, colocation vendors, or system integrators