51 - 200 employees
Founded 2020
🏭 Manufacturing
🔧 Hardware
🔬 Science
💰 $27.8M Series A - Black Semiconductor on 2024-06
Manufacturing • Hardware • Science
Black Semiconductor is a German semiconductor technology company that integrates graphene-based photonics directly onto electronic chips to enable high-speed, low-power, and scalable chip-to-chip optical connectivity. The company develops CMOS-compatible, BEOL-friendly wafer processes for combining photonics and electronics on one 300mm wafer, targeting data centers and chip manufacturers that need higher bandwidth, lower latency, and greater energy efficiency. Black Semiconductor operates a large fabrication campus (FabONE), has raised significant funding and public grants to scale pilot production, and focuses on commercialization of integrated photonic interconnects for high-performance computing and communications.
🔥 6 minutes ago
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51 - 200 employees
Founded 2020
🏭 Manufacturing
🔧 Hardware
🔬 Science
💰 $27.8M Series A - Black Semiconductor on 2024-06
Manufacturing • Hardware • Science
Black Semiconductor is a German semiconductor technology company that integrates graphene-based photonics directly onto electronic chips to enable high-speed, low-power, and scalable chip-to-chip optical connectivity. The company develops CMOS-compatible, BEOL-friendly wafer processes for combining photonics and electronics on one 300mm wafer, targeting data centers and chip manufacturers that need higher bandwidth, lower latency, and greater energy efficiency. Black Semiconductor operates a large fabrication campus (FabONE), has raised significant funding and public grants to scale pilot production, and focuses on commercialization of integrated photonic interconnects for high-performance computing and communications.
• Own overall EPIC SoC technical leadership from initial concept through production • Drive cross-functional technical alignment across photonics, analog, digital, technology, and product teams • Build and document the overall product architecture • Translate the MRD into a complete, internally consistent, implementable PRD • Own digital subsystem architecture, including core logic, on-chip interconnect fabric, and subsystem partitioning • Own high-speed I/O subsystem architecture, including SerDes and protocol digital logic for UCIe, PCIe, and Ethernet • Integrate analog/RF, photonics, packaging, and memory subsystem architectures into a coherent full-chip architecture • Drive full-chip performance, power, and area trade-off analysis • Partner with external vendors and third-party IP providers on full-chip validation • Work with characterization teams on product characterization • Present the integrated architecture and PRD to product management and engineering leadership • Own the architecture through sign-off
• 7–10 years of experience in SoC or product architecture roles • Proven SoC/product architecture ownership • Experience taking a product from MRD-level requirements through a complete, implementable PRD-level architecture • Experience covering multiple subsystems and at least one full product architecture cycle • Deep hands-on high-speed I/O subsystem expertise • Expertise in high-speed SerDes and protocol digital logic for UCIe, PCIe, and Ethernet • Strong digital subsystem and on-chip interconnect fabric architecture experience • Experience defining digital subsystem partitioning for a complex SoC • Strong cross-domain integration skills across analog, photonic, packaging, and memory architecture inputs • Experience translating marketing/product requirements into engineering-actionable architecture specifications • Experience reasoning about full-chip performance, power, and area trade-offs • Experience with third-party IP vendors, external IP evaluation and selection, and design integration partners • Experience with architecture specification and requirements management tooling • Experience with UCIe, PCIe, and Ethernet protocol/standards documentation and compliance tooling • Experience with architecture and performance modeling tools, including full-chip performance/power models • Python and C++ for modeling, scripting, and analysis • Experience with collaboration and documentation platforms • Nice to have: previous SoC Chief Engineer experience • Nice to have: familiarity with silicon photonics or electro-optic I/O • Nice to have: familiarity with advanced 2.5D/3D packaging and chiplet integration • Nice to have: experience working with product management and/or customers on MRD-level requirements • Nice to have: experience with CXL or adjacent die-to-die/coherent interconnect standards
• Flexible work arrangements and work-life harmony • Autonomy and professional development • Continuous learning • Comprehensive benefits package • Outstanding insurance • Pension • Virtual stock options • Inclusive and supportive work environment
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