Lead Application Engineer

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☕ Washington – Remote

☕ Washington – Remote

💵 $92.4k - $171.6k / year

⏰ Full Time

🟠 Senior

💻 Application Engineer

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Cadence Design Systems

WebsiteLinkedInAll Job Openings

10,000+ employees

💼 Consulting

🏥 Healthcare

🏭 Manufacturing

Consulting • Healthcare • Manufacturing

Cadence Design Systems is a pivotal leader in electronics and system design, leveraging more than 30 years of computational software expertise. The company employs its Intelligent System Design strategy to deliver software, hardware, and IP that transform design concepts into reality. Cadence serves some of the world's most innovative companies, facilitating the creation of advanced electronic products across various applications including hyperscale computing, 5G communications, automotive, mobile, aerospace, consumer, industrial, and healthcare sectors.

📋 Description

• Define and lead development of advanced packaging and 3DIC analysis flows for foundry and customer solutions • Analyze customer environments and evaluate appropriate solutions • Anticipate technical issues and develop creative solutions • Lead a wide range of technical projects • Address high-speed, high-performance signal and power integrity issues • Collaborate with peers and other business groups • Communicate with Cadence R&D, Product Engineering, Marketing, and customers • Understand customer success criteria and ensure customer success • Stay aware of competitive technologies and customer requirements

🎯 Requirements

• Must be located in the United States • Bachelor’s degree in Electrical or Electronics Engineering • Minimum 15 years of experience with Signal Integrity, Power Integrity, Electromagnetics, Thermal, and RF related to package and PCB design • 5+ years of experience with Cadence SI/PI tools • Experience with Allegro platform tools including Sigrity, Clarity, PCB Editor, and ICP preferred • Expert knowledge of Cadence toolset and/or equivalent competitor toolsets • Design experience and industry knowledge in Signal, Power, or Thermal analysis associated with IC, package, or PCB design • Strong knowledge of advanced packaging concepts • Strong knowledge of 2.5D, 3DIC, and stacked die technologies • Understanding of chip-level CMOS design concepts desired • Strong customer-facing communication and problem-solving skills • Strong personal drive for continuous learning and expanding professional skill sets • Excellent verbal and written communication skills

🏖️ Benefits

• Annual incentive compensation may include bonus and equity • Paid vacation • Paid holidays • 401(k) plan with employer match • Employee stock purchase plan • Medical plan options • Dental plan options • Vision plan options