
10,000+ employees
Founded 1993
🏥 Healthcare
🏭 Manufacturing
🤖 Artificial Intelligence
Healthcare • Manufacturing • Artificial Intelligence
NVIDIA is a leading technology company specializing in accelerated computing and artificial intelligence. NVIDIA pioneers advancements in graphical processing units (GPUs), cloud computing, data centers, and virtual reality, with a focus on gaming, automotive, healthcare, and robotics industries. The company's innovations, such as NVIDIA Omniverse, transform traditional digital processes by enabling high-fidelity simulations and rendering tasks. Their applications span various industries, from autonomous vehicles using NVIDIA DRIVE to healthcare solutions with NVIDIA Clara, and AI-driven analytics and workflows.
🔥 1 minute ago
🏄 California – Remote
💵 $320k - $488.8k / year
⏰ Full Time
🟠 Senior
🔴 Lead
👷🏻♀️ Engineer
🦅 H1B Visa Sponsor
👻 Ghost score 1%
Where this job comes from
Posted on NVIDIA's careers page, not through a job board
First seen by Remote Rocketship 1 minute ago

10,000+ employees
Founded 1993
🏥 Healthcare
🏭 Manufacturing
🤖 Artificial Intelligence
Healthcare • Manufacturing • Artificial Intelligence
NVIDIA is a leading technology company specializing in accelerated computing and artificial intelligence. NVIDIA pioneers advancements in graphical processing units (GPUs), cloud computing, data centers, and virtual reality, with a focus on gaming, automotive, healthcare, and robotics industries. The company's innovations, such as NVIDIA Omniverse, transform traditional digital processes by enabling high-fidelity simulations and rendering tasks. Their applications span various industries, from autonomous vehicles using NVIDIA DRIVE to healthcare solutions with NVIDIA Clara, and AI-driven analytics and workflows.
• Lead development and execution of corporate-level strategies for high-speed signaling technologies across advanced semiconductor packaging, sockets, and connectors • Oversee technical direction and implementation for next-generation products ranging from ultra-mobile to high-performance AI and HPC platforms • Architect and deliver advanced interconnect and packaging solutions for UCIe, HBM, DDR, PCIe, and 224G/448G SerDes • Enable advanced packaging solutions for co-packaged optics, stacked die, chiplet-based architectures, and IVR solutions • Develop modeling and characterization flows, flow automations, and design-for-high-volume-manufacturing techniques • Provide strategic counsel as a recognized subject matter expert to senior leadership on emerging technologies, technology investment, and research priorities in signaling, packaging, and system integration
• 15+ years leading innovations spanning high-speed signal integrity, computational electromagnetics, and semiconductor assembly technologies • MS/PhD in Electrical Engineering or equivalent with 15+ years of industry experience • Hands-on invention and deployment of advanced solutions such as EMIB, UCIe, CPO, and high-density connectors • Deep experience with electrical, computer, and packaging engineering and deploying them in products • Demonstrated ability to manage and mentor teams of highly skilled engineers, define methodologies, and deliver complex projects from research to high-volume manufacturing • Proven track record of bringing advanced signal integrity concepts from research to product • Pioneer-level experience in an industry-standard high-speed signaling technology • Deep knowledge of operation and manufacturing challenges of package substrates, PCBs, cables, and connectors
• Equity • Benefits
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