
11 - 50 employees
Founded 2026
🔧 Hardware
🤖 Artificial Intelligence
🤝 B2B
Hardware • Artificial Intelligence • B2B
TYLsemi is a chiplet-first silicon company focused on AI infrastructure solutions. It provides production-ready, validated chiplets and a unified platform to take designs from architecture to deployed silicon, enabling faster, lower-risk development of AI systems. TYLsemi's offerings (branded TYL. IO, TYL. Power, TYL. Forge) target critical AI infrastructure functions—XPUs, switches, connectivity, power, and system scaling—and it also offers chiplet-enabled custom silicon, packaging, and manufacturing integration. The company promotes up to ~50% faster development and reduced costs, and recently raised $43M in an oversubscribed early-stage funding round.
Selected: 🆕 Date Added.
🕒 September 16
Principal Engineer defining Ethernet scale-up architectures for TYLsemi’s AI/HPC chiplet infrastructure. Leading RTL, networking subsystem design, and silicon delivery across global engineering teams.
🕒 August 19
Design Verification Lead architecting reusable SoC verification platforms for TYLsemi’s AI/HPC chiplet infrastructure. Driving AI-enabled verification, coverage closure, and first-pass silicon success.
🕒 July 27
Principal Engineer leading timing analysis and signoff for ASIC/SOC designs. Driving cross-team collaboration and successful tape-outs at advanced technology nodes.
🕒 July 27
Lead DFT architecture strategy for complex ASIC/SOC designs at TylSemi. Collaborate with cross-functional teams to achieve high test coverage and silicon bring-up success.